A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition
Chu, Kunmo (author) / Bae, Ki Deok (author) / Song, Byong Gwon (author) / Kim, Jaekwan (author) / Park, Yong Young (author) / Xianyu, Wenxu (author) / Lee, Chang Seung (author) / Sohn, Yoonchul (author)
Applied surface science ; 453 ; 31-36
2018-01-01
6 pages
Article (Journal)
English
DDC:
620.44
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