Diffusion barrier performance of novel Ti/TaN double layers for Cu metallization

Zhou, Y. M. / He, M. Z. / Xie, Z. | British Library Online Contents | 2014

Electrical characterization of reactively sputtered TiN diffusion barrier layers for copper metallization

Kaufmann, C. / Baumann, J. / Gessner, T. et al. | British Library Online Contents | 1996

Ti-diffusion barrier in Cu-based metallization

Braud, F. / Torres, J. / Palleau, J. et al. | British Library Online Contents | 1996

Diffusion barrier performance of TiVCr alloy film in Cu metallization

Tsai, D. C. / Huang, Y. L. / Lin, S. R. et al. | British Library Online Contents | 2011

Electrical characterization of conductive and non-conductive barrier layers for Cu-metallization

Ahrens, C. / Depta, D. / Schitthelm, F. et al. | British Library Online Contents | 1996