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Ti-diffusion barrier in Cu-based metallization
Ti-diffusion barrier in Cu-based metallization
Ti-diffusion barrier in Cu-based metallization
Braud, F. (Autor:in) / Torres, J. (Autor:in) / Palleau, J. (Autor:in) / Mermet, J. L. (Autor:in) / Mouche, M. J. (Autor:in) / Gessner, T / Schulz, S. E.
01.01.1996
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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