Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Chen, Wei-Yu (Autor:in) / Tu, Wei (Autor:in) / Chang, Hsiang-Ching (Autor:in) / Chou, Tzu-Ting (Autor:in) / Duh, Jenq-Gong (Autor:in)
MATERIALS LETTERS ; 134 ; 184-186
01.01.2014
3 pages
Aufsatz (Zeitschrift)
Unbekannt
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