A platform for research: civil engineering, architecture and urbanism
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Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Chen, Wei-Yu (author) / Tu, Wei (author) / Chang, Hsiang-Ching (author) / Chou, Tzu-Ting (author) / Duh, Jenq-Gong (author)
MATERIALS LETTERS ; 134 ; 184-186
2014-01-01
3 pages
Article (Journal)
Unknown
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