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Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
Kim, S. H. (Autor:in) / Yu, J. (Autor:in)
MATERIALS LETTERS ; 106 ; 75-78
01.01.2013
4 pages
Aufsatz (Zeitschrift)
Englisch
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