Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Tian, Ruyu / Hang, Chunjin / Tian, Yanhong et al. | British Library Online Contents | 2018

Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Tian, Ruyu / Hang, Chunjin / Tian, Yanhong et al. | British Library Online Contents | 2018

Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

Kim, D.-G. / Jung, S.-B. | British Library Online Contents | 2005

Growth Behavior of Intermetallic Compounds on Sn-3.5Ag-0.5Cu/Cu (Ni) Interface under Thermal-Shearing Cycling Condition

Lihua, Q. / Jihua, H. / Jiangang, Z. | British Library Online Contents | 2007

Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

Wang, M. / Wang, J. / Feng, H. et al. | British Library Online Contents | 2012