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Improvement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablation
Improvement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablation
Improvement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablation
Ku, Chun-Han (Autor:in) / Wang, Wei-Kai (Autor:in) / Horng, Ray-Hua (Autor:in)
Materials science in semiconductor processing ; 95 ; 48-53
01.01.2019
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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