Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
Highlights Sn3.5Ag0.5Cu–nano-Al2O3 composite solder BGA joints was investigated. Both scallop- and prism- modes were observed after reflowing. Al2O3 suppressed Cu6Sn5 growth, significantly improving the shear strength.
Abstract A Sn3.5Ag0.5Cu (SAC)–XAl2O3 nano-composite solder was prepared by adding 100nm Al2O3 to SAC (wt.%) solder. The interfacial microstructures and mechanical properties of SAC–XAl2O3 nano-composite solder balls on immersion Sn surface finished BGA joints after multiple reflows was investigated. As a whole, adding Al2O3 nanoparticles to SAC solders significantly changed in the interfacial microstructure, and both scallop-type and prism-type modes were observed in the plain SAC solder and SAC–XAl2O3 nano-composite solder after reflowing, respectively. The nanoparticles suppressed the growth of the Cu6Sn5 layer, significantly improving the shear strength. The fracture surfaces of the plain SAC solder showed a semi-brittle fracture mode, but those of the SAC–XAl2O3 nano-composite solder exhibited typical ductile failures.
Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
Highlights Sn3.5Ag0.5Cu–nano-Al2O3 composite solder BGA joints was investigated. Both scallop- and prism- modes were observed after reflowing. Al2O3 suppressed Cu6Sn5 growth, significantly improving the shear strength.
Abstract A Sn3.5Ag0.5Cu (SAC)–XAl2O3 nano-composite solder was prepared by adding 100nm Al2O3 to SAC (wt.%) solder. The interfacial microstructures and mechanical properties of SAC–XAl2O3 nano-composite solder balls on immersion Sn surface finished BGA joints after multiple reflows was investigated. As a whole, adding Al2O3 nanoparticles to SAC solders significantly changed in the interfacial microstructure, and both scallop-type and prism-type modes were observed in the plain SAC solder and SAC–XAl2O3 nano-composite solder after reflowing, respectively. The nanoparticles suppressed the growth of the Cu6Sn5 layer, significantly improving the shear strength. The fracture surfaces of the plain SAC solder showed a semi-brittle fracture mode, but those of the SAC–XAl2O3 nano-composite solder exhibited typical ductile failures.
Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
Tsao, L.C. (Autor:in) / Wu, R.W. (Autor:in) / Cheng, Te-Hsien (Autor:in) / Fan, Kuo-Huan (Autor:in) / Chen, R.S. (Autor:in)
08.03.2013
8 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
| British Library Online Contents | 2013
| British Library Online Contents | 2012
| British Library Online Contents | 2012
Shape Prediction and Reliability Design of Ball Grid Array Solder Joints
| British Library Online Contents | 2007
Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls
| British Library Online Contents | 2008