Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Si3N4 ceramic copper-clad substrate and preparation method thereof
The invention belongs to the technical field of ceramic metallization, and particularly relates to a Si3N4 ceramic copper-clad substrate and a preparation method thereof. The preparation method comprises the following steps: (1) pretreating the Si3N4 ceramic substrate and the oxygen-free Cu sheet; (2) preparing an organic solvent; (3) preparing Ni metal slurry; (4) printing a Ni layer on the surface of the Si3N4 ceramic substrate; (5) sintering Ni metallization; and (6) the Ni metallized Si3N4 ceramic substrate is coated with Cu and sintered. The preparation method is simple and convenient in process and low in cost, the porous Ni metal layer is prepared on the surface of the Si3N4 ceramic through the silk-screen printing and sintering process, when Cu reaches the melting point, Cu melt is spread on the surface of the porous Ni, pressure is not needed, the Cu melt is successfully attached to the surface of the Si3N4 ceramic, and the Si3N4 ceramic Cu-coated plate can be prepared. Particularly, a patterned ceramic Cu-coated substrate can be prepared by designing a printing pattern type Ni layer.
本发明属于陶瓷金属化技术领域，特别涉及一种Si3N4陶瓷覆铜基板及其制备方法。制备方法包括：(1)对Si3N4陶瓷基板和无氧Cu片预处理；(2)配制有机溶剂；(3)制备Ni金属浆料；(4)在Si3N4陶瓷基板表面印刷Ni层；(5)烧结Ni金属化；(6)Ni金属化的Si3N4陶瓷基板覆Cu烧结。该制备方法工艺简便，成本低，通过丝网印刷和烧结工艺在Si3N4陶瓷表面制备多孔的Ni金属层，其作用当Cu达到其熔点，Cu熔体在多孔Ni表面进行铺展，无需压力，使其成功附着在Si3N4陶瓷表面，可制备Si3N4陶瓷覆Cu板。特别是，通过设计印刷图案型的Ni层，可制备图案化的陶瓷覆Cu基板。
Si3N4 ceramic copper-clad substrate and preparation method thereof
The invention belongs to the technical field of ceramic metallization, and particularly relates to a Si3N4 ceramic copper-clad substrate and a preparation method thereof. The preparation method comprises the following steps: (1) pretreating the Si3N4 ceramic substrate and the oxygen-free Cu sheet; (2) preparing an organic solvent; (3) preparing Ni metal slurry; (4) printing a Ni layer on the surface of the Si3N4 ceramic substrate; (5) sintering Ni metallization; and (6) the Ni metallized Si3N4 ceramic substrate is coated with Cu and sintered. The preparation method is simple and convenient in process and low in cost, the porous Ni metal layer is prepared on the surface of the Si3N4 ceramic through the silk-screen printing and sintering process, when Cu reaches the melting point, Cu melt is spread on the surface of the porous Ni, pressure is not needed, the Cu melt is successfully attached to the surface of the Si3N4 ceramic, and the Si3N4 ceramic Cu-coated plate can be prepared. Particularly, a patterned ceramic Cu-coated substrate can be prepared by designing a printing pattern type Ni layer.
本发明属于陶瓷金属化技术领域，特别涉及一种Si3N4陶瓷覆铜基板及其制备方法。制备方法包括：(1)对Si3N4陶瓷基板和无氧Cu片预处理；(2)配制有机溶剂；(3)制备Ni金属浆料；(4)在Si3N4陶瓷基板表面印刷Ni层；(5)烧结Ni金属化；(6)Ni金属化的Si3N4陶瓷基板覆Cu烧结。该制备方法工艺简便，成本低，通过丝网印刷和烧结工艺在Si3N4陶瓷表面制备多孔的Ni金属层，其作用当Cu达到其熔点，Cu熔体在多孔Ni表面进行铺展，无需压力，使其成功附着在Si3N4陶瓷表面，可制备Si3N4陶瓷覆Cu板。特别是，通过设计印刷图案型的Ni层，可制备图案化的陶瓷覆Cu基板。
Si3N4 ceramic copper-clad substrate and preparation method thereof
一种Si3N4陶瓷覆铜基板及其制备方法
LIU GUIWU (Autor:in) / WANG BEIJI (Autor:in) / ZHANG XIANGZHAO (Autor:in) / QIAO GUANJUN (Autor:in) / YANG JIAN (Autor:in) / ZHOU YANSHENG (Autor:in)
21.11.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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