Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Copper-clad ceramic substrate and preparation method thereof
The invention discloses a copper-clad ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: coating two surfaces of a high-performance ceramic substrate with active metal slurry through silk-screen printing, and drying; the two faces of the high-performance ceramic substrate printed with the slurry are coated with oxygen-free copper sheets, the high-performance ceramic substrate is put into a vacuum brazing furnace to be treated, after treatment is finished, the high-performance ceramic substrate is cooled to the room temperature, and the copper-coated ceramic substrate is obtained. The copper-clad ceramic substrate has good thermal conductivity and mechanical strength, and meanwhile, the bonding strength of the copper sheet layer and the ceramic substrate is improved.
本发明公开了一种覆铜陶瓷基板及其制备方法，包括以下步骤：将高性能陶瓷基板的两面经丝网印刷涂覆活性金属浆料，烘干；将印好浆料的高性能陶瓷基板两面覆上无氧铜片，放入真空钎焊炉处理，结束后冷却至室温，得到覆铜陶瓷基板。本发明的覆铜陶瓷基板具有良好的热导性和机械强度，同时铜片层与陶瓷基板的结合强度得到提高。
Copper-clad ceramic substrate and preparation method thereof
The invention discloses a copper-clad ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: coating two surfaces of a high-performance ceramic substrate with active metal slurry through silk-screen printing, and drying; the two faces of the high-performance ceramic substrate printed with the slurry are coated with oxygen-free copper sheets, the high-performance ceramic substrate is put into a vacuum brazing furnace to be treated, after treatment is finished, the high-performance ceramic substrate is cooled to the room temperature, and the copper-coated ceramic substrate is obtained. The copper-clad ceramic substrate has good thermal conductivity and mechanical strength, and meanwhile, the bonding strength of the copper sheet layer and the ceramic substrate is improved.
本发明公开了一种覆铜陶瓷基板及其制备方法，包括以下步骤：将高性能陶瓷基板的两面经丝网印刷涂覆活性金属浆料，烘干；将印好浆料的高性能陶瓷基板两面覆上无氧铜片，放入真空钎焊炉处理，结束后冷却至室温，得到覆铜陶瓷基板。本发明的覆铜陶瓷基板具有良好的热导性和机械强度，同时铜片层与陶瓷基板的结合强度得到提高。
Copper-clad ceramic substrate and preparation method thereof
覆铜陶瓷基板及其制备方法
WU BO (Autor:in) / YANG YONGJUN (Autor:in) / XU ZHILIANG (Autor:in) / LIAO DAN (Autor:in) / JIN HAIYAN (Autor:in) / NIE YONG (Autor:in) / YOU XINYU (Autor:in) / MA JIEHUI (Autor:in) / ZHANG YEHUA (Autor:in)
17.11.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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