Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of ceramic copper-clad substrate
The invention discloses a preparation method of a ceramic copper-clad substrate. The preparation method comprises the following steps: copper sheet selection, wherein the surface of a copper sheet should not be seriously oxidized, discolored or polluted, the purity of the copper sheet is 99%-99.99%, the hardness of the copper sheet is 90-110 HV, and the conductivity of the copper sheet is 58-60 MS/m; selection of a ceramic substrate, wherein the ceramic substrate is fine and white in appearance and does not have obvious defects, spots, cracks and ceramic fences; pretreatment, wherein ultrasonic cleaning is conducted on the surfaces of the selected copper sheet and the selected ceramic substrate to remove dust and oil stains on the surfaces, and then rapid air drying is conducted; treatment, wherein the pretreated copper sheet is put into air to be oxidized so as to allow a copper oxide transition layer to be formed on a junction surface, then the copper sheet is tidily laid on the ceramic substrate, sintering is conducted under the protection of nitrogen, a sintering temperature is 1050 DEG C to 1100 DEG C, and sintering time is 30-100 min; and sampling and inspection after manufacturing, wherein a qualified product is packaged and warehoused. Compared with the prior art, the method has the advantages that bonding between the copper sheet and the ceramic substrate is firm, the surface of the copper sheet is flat, and the quality of the product is good.
本发明公开了一种陶瓷覆铜基板的制备方法，包括以下步骤：铜片选择：铜片表面应无严重氧化、变色、杂质，铜片纯度99％‑99.99％，硬度90‑110HV,电导率58‑60MS/m；陶瓷基板选择：外观应细密、洁白，不应有明显的损缺、斑点、裂纹和瓷笆；预处理：分别将选择的铜片和陶瓷基本表面进行超声波清洁，去除表面的灰尘和油污，进行快速的风干；烧结将预处理过的铜片放入空气中进行氧化，使得结合面形成一层氧化铜过渡层，然后将铜片整齐的铺设在陶瓷基板上，然后在氮气的保护下进行烧结，烧结温度为1050度‑1100度，烧结时间为30‑100min；制成后抽样检测，检测合格包装入库。本发明与现有技术相比的优点在于：铜片和陶瓷基板之间键合较为牢靠，同时铜片表面较为平整，质量较好。
Preparation method of ceramic copper-clad substrate
The invention discloses a preparation method of a ceramic copper-clad substrate. The preparation method comprises the following steps: copper sheet selection, wherein the surface of a copper sheet should not be seriously oxidized, discolored or polluted, the purity of the copper sheet is 99%-99.99%, the hardness of the copper sheet is 90-110 HV, and the conductivity of the copper sheet is 58-60 MS/m; selection of a ceramic substrate, wherein the ceramic substrate is fine and white in appearance and does not have obvious defects, spots, cracks and ceramic fences; pretreatment, wherein ultrasonic cleaning is conducted on the surfaces of the selected copper sheet and the selected ceramic substrate to remove dust and oil stains on the surfaces, and then rapid air drying is conducted; treatment, wherein the pretreated copper sheet is put into air to be oxidized so as to allow a copper oxide transition layer to be formed on a junction surface, then the copper sheet is tidily laid on the ceramic substrate, sintering is conducted under the protection of nitrogen, a sintering temperature is 1050 DEG C to 1100 DEG C, and sintering time is 30-100 min; and sampling and inspection after manufacturing, wherein a qualified product is packaged and warehoused. Compared with the prior art, the method has the advantages that bonding between the copper sheet and the ceramic substrate is firm, the surface of the copper sheet is flat, and the quality of the product is good.
本发明公开了一种陶瓷覆铜基板的制备方法，包括以下步骤：铜片选择：铜片表面应无严重氧化、变色、杂质，铜片纯度99％‑99.99％，硬度90‑110HV,电导率58‑60MS/m；陶瓷基板选择：外观应细密、洁白，不应有明显的损缺、斑点、裂纹和瓷笆；预处理：分别将选择的铜片和陶瓷基本表面进行超声波清洁，去除表面的灰尘和油污，进行快速的风干；烧结将预处理过的铜片放入空气中进行氧化，使得结合面形成一层氧化铜过渡层，然后将铜片整齐的铺设在陶瓷基板上，然后在氮气的保护下进行烧结，烧结温度为1050度‑1100度，烧结时间为30‑100min；制成后抽样检测，检测合格包装入库。本发明与现有技术相比的优点在于：铜片和陶瓷基板之间键合较为牢靠，同时铜片表面较为平整，质量较好。
Preparation method of ceramic copper-clad substrate
一种陶瓷覆铜基板的制备方法
MEI ZEQUN (Autor:in) / ZHANG JIAN (Autor:in)
09.04.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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