Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Preparation method of AlN ceramic copper-clad substrate
The invention belongs to the technical field of ceramic metallization, and relates to a preparation method of an AlN ceramic copper-clad substrate. And the bonding of the AlN substrate and the copper foil is realized through a secondary bonding process method. An AlN ceramic substrate is coated with an active metal brazing layer and then attached to an oxygen-free copper foil, a bonding machine is used for heating and pressurizing in a vacuum environment for pre-bonding, a product obtained after pre-bonding is put into a vacuum brazing furnace for secondary bonding, and therefore the prepared AlN ceramic copper-clad substrate can effectively reduce the defects of cavities, pseudo soldering and the like, and the service life of the AlN ceramic copper-clad substrate is prolonged. And therefore, the copper foil and the AlN ceramic substrate can be jointed more easily, uniformly and firmly.
本发明属于陶瓷金属化技术领域，涉及一种AlN陶瓷覆铜基板的制备方法。通过二次键合工艺方法实现AlN基板与铜箔的键合。在AlN陶瓷基板上涂覆活性金属钎焊层后与无氧铜箔贴合，使用邦定机在真空环境下加温加压进行预键合，将预键合后的产品放入真空钎焊炉中进行二次键合，由此制备得到的AlN陶瓷覆铜基板能够有效减少空洞、虚焊等缺陷，使铜箔与AlN陶瓷基板的接合更容易，更均匀，更牢靠。
Preparation method of AlN ceramic copper-clad substrate
The invention belongs to the technical field of ceramic metallization, and relates to a preparation method of an AlN ceramic copper-clad substrate. And the bonding of the AlN substrate and the copper foil is realized through a secondary bonding process method. An AlN ceramic substrate is coated with an active metal brazing layer and then attached to an oxygen-free copper foil, a bonding machine is used for heating and pressurizing in a vacuum environment for pre-bonding, a product obtained after pre-bonding is put into a vacuum brazing furnace for secondary bonding, and therefore the prepared AlN ceramic copper-clad substrate can effectively reduce the defects of cavities, pseudo soldering and the like, and the service life of the AlN ceramic copper-clad substrate is prolonged. And therefore, the copper foil and the AlN ceramic substrate can be jointed more easily, uniformly and firmly.
本发明属于陶瓷金属化技术领域，涉及一种AlN陶瓷覆铜基板的制备方法。通过二次键合工艺方法实现AlN基板与铜箔的键合。在AlN陶瓷基板上涂覆活性金属钎焊层后与无氧铜箔贴合，使用邦定机在真空环境下加温加压进行预键合，将预键合后的产品放入真空钎焊炉中进行二次键合，由此制备得到的AlN陶瓷覆铜基板能够有效减少空洞、虚焊等缺陷，使铜箔与AlN陶瓷基板的接合更容易，更均匀，更牢靠。
Preparation method of AlN ceramic copper-clad substrate
一种AlN陶瓷覆铜基板的制备方法
SUN YONGJIAN (Autor:in) / JIA JUNFENG (Autor:in) / ZHANG WEI (Autor:in) / JIAO HUIMIN (Autor:in) / DOU XUEGANG (Autor:in) / CHEN ZHIZHONG (Autor:in) / KANG XIANGNING (Autor:in)
05.09.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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