Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Silicon nitride ceramic copper-clad substrate and preparation method thereof
The invention provides a silicon nitride ceramic copper-clad substrate and a preparation method thereof, and belongs to the technical field of ceramic copper-clad substrates for power modules, and the preparation method comprises the following steps: employing a chemical solution to perform pretreatment of a silicon nitride ceramic bare board, a copper foil sheet and a solder sheet; reducing the pretreated silicon nitride ceramic bare board, copper foil sheet and solder sheet in a reducing atmosphere; clamping the copper foil sheet, the solder sheet, the silicon nitride ceramic bare board, the solder sheet and the copper foil sheet in a tool clamp according to a stacking sequence; the tool clamp is placed in a vacuum furnace; and welding the copper foil and the silicon nitride ceramic bare board into an integrated substrate by adopting an AMB process to obtain the silicon nitride ceramic copper-clad substrate. The substrate has the technical effects that the fresh surface of the raw material can be activated and restored, the influence on the reaction wetting between the silicon nitride ceramic bare board and the solder sheet due to the existence of impurity elements is avoided, the generation of holes in the cladding surface is reduced, the reliability is improved, and the high-reliability packaging requirement of a high-power module is met.
本发明提供了一种氮化硅陶瓷覆铜基板及其制备方法，属于功率模块用陶瓷覆铜基板技术领域，制备方法包括以下步骤：采用化学溶液对氮化硅陶瓷裸板、铜箔片、焊料片进行预处理；采用还原气氛对经过预处理的氮化硅陶瓷裸板、铜箔片、焊料片进行还原处理；按照铜箔片、焊料片、氮化硅陶瓷裸板、焊料片、铜箔片的叠设顺序装夹在工装夹具中；将工装夹具放置于真空炉中；采用AMB工艺使铜箔片与氮化硅陶瓷裸板焊接为一体化基板，得到氮化硅陶瓷覆铜基板。技术效果：可以活化、还原出原材料的新鲜表面，避免由于杂质元素的存在而影响氮化硅陶瓷裸板与焊料片之间的反应润湿，减少覆接面空洞的产生，提高可靠性，满足大功率模块的高可靠封装要求。
Silicon nitride ceramic copper-clad substrate and preparation method thereof
The invention provides a silicon nitride ceramic copper-clad substrate and a preparation method thereof, and belongs to the technical field of ceramic copper-clad substrates for power modules, and the preparation method comprises the following steps: employing a chemical solution to perform pretreatment of a silicon nitride ceramic bare board, a copper foil sheet and a solder sheet; reducing the pretreated silicon nitride ceramic bare board, copper foil sheet and solder sheet in a reducing atmosphere; clamping the copper foil sheet, the solder sheet, the silicon nitride ceramic bare board, the solder sheet and the copper foil sheet in a tool clamp according to a stacking sequence; the tool clamp is placed in a vacuum furnace; and welding the copper foil and the silicon nitride ceramic bare board into an integrated substrate by adopting an AMB process to obtain the silicon nitride ceramic copper-clad substrate. The substrate has the technical effects that the fresh surface of the raw material can be activated and restored, the influence on the reaction wetting between the silicon nitride ceramic bare board and the solder sheet due to the existence of impurity elements is avoided, the generation of holes in the cladding surface is reduced, the reliability is improved, and the high-reliability packaging requirement of a high-power module is met.
本发明提供了一种氮化硅陶瓷覆铜基板及其制备方法，属于功率模块用陶瓷覆铜基板技术领域，制备方法包括以下步骤：采用化学溶液对氮化硅陶瓷裸板、铜箔片、焊料片进行预处理；采用还原气氛对经过预处理的氮化硅陶瓷裸板、铜箔片、焊料片进行还原处理；按照铜箔片、焊料片、氮化硅陶瓷裸板、焊料片、铜箔片的叠设顺序装夹在工装夹具中；将工装夹具放置于真空炉中；采用AMB工艺使铜箔片与氮化硅陶瓷裸板焊接为一体化基板，得到氮化硅陶瓷覆铜基板。技术效果：可以活化、还原出原材料的新鲜表面，避免由于杂质元素的存在而影响氮化硅陶瓷裸板与焊料片之间的反应润湿，减少覆接面空洞的产生，提高可靠性，满足大功率模块的高可靠封装要求。
Silicon nitride ceramic copper-clad substrate and preparation method thereof
氮化硅陶瓷覆铜基板及其制备方法
ZHANG YIZHENG (Autor:in) / GAO LING (Autor:in) / WU YAGUANG (Autor:in) / LIU XU (Autor:in) / BAO YUXI (Autor:in) / ZHANG TENG (Autor:in) / ZHANG JINLI (Autor:in) / ZHANG XIAOJUN (Autor:in) / LIU LINJIE (Autor:in) / QIAO ZHIZHUANG (Autor:in)
20.04.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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