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Silicon nitride ceramic copper-clad substrate and preparation method thereof
The invention discloses a silicon nitride ceramic copper-clad substrate and a preparation method thereof.According to the silicon nitride ceramic copper-clad substrate and the preparation method thereof, an active metal solder layer between a silicon nitride ceramic substrate and an oxygen-free copper layer is changed, layering is arranged in the active metal solder layer, and different solder combinations of an active metal solder layer A and an active metal solder layer B are adopted, so that the silicon nitride ceramic copper-clad substrate is prepared. The thermal expansion coefficient and the elastic modulus of the active metal solder layer are changed, so that the strain energy in the active metal solder layer is reduced and decomposed, and the surface of the ceramic substrate is treated by laser, so that the bonding capacity of the ceramic substrate and the copper layer is stronger, and the service life is longer; in addition, the cavitation effect of ultrasonic waves is utilized in the brazing process, brazing is assisted, the brazing time and cost are saved, and the method is widely applied to the ceramic copper-clad substrate market in China.
本发明公开了一种氮化硅陶瓷覆铜基板及其制备方法，本发明通过氮化硅陶瓷基板与无氧铜层之间的活性金属焊料层的改变，通过在活性金属焊料层中设置分层的方式，通过活性金属焊料A层与B层的不同焊料组合，改变其热膨胀系数与弹性模量，使得活性金属焊料层内的应变能得以被降低与分解，并且本发明还使用激光处理陶瓷基板表面，使得陶瓷基板与铜层的结合能力更强，并可以具有更长的使用寿命；此外本发明还利用了在钎焊过程中利用超声波的空化作用，辅助钎焊，节约了钎焊时间与成本，在我国陶瓷覆铜基板市场有着广泛的应用。
Silicon nitride ceramic copper-clad substrate and preparation method thereof
The invention discloses a silicon nitride ceramic copper-clad substrate and a preparation method thereof.According to the silicon nitride ceramic copper-clad substrate and the preparation method thereof, an active metal solder layer between a silicon nitride ceramic substrate and an oxygen-free copper layer is changed, layering is arranged in the active metal solder layer, and different solder combinations of an active metal solder layer A and an active metal solder layer B are adopted, so that the silicon nitride ceramic copper-clad substrate is prepared. The thermal expansion coefficient and the elastic modulus of the active metal solder layer are changed, so that the strain energy in the active metal solder layer is reduced and decomposed, and the surface of the ceramic substrate is treated by laser, so that the bonding capacity of the ceramic substrate and the copper layer is stronger, and the service life is longer; in addition, the cavitation effect of ultrasonic waves is utilized in the brazing process, brazing is assisted, the brazing time and cost are saved, and the method is widely applied to the ceramic copper-clad substrate market in China.
本发明公开了一种氮化硅陶瓷覆铜基板及其制备方法，本发明通过氮化硅陶瓷基板与无氧铜层之间的活性金属焊料层的改变，通过在活性金属焊料层中设置分层的方式，通过活性金属焊料A层与B层的不同焊料组合，改变其热膨胀系数与弹性模量，使得活性金属焊料层内的应变能得以被降低与分解，并且本发明还使用激光处理陶瓷基板表面，使得陶瓷基板与铜层的结合能力更强，并可以具有更长的使用寿命；此外本发明还利用了在钎焊过程中利用超声波的空化作用，辅助钎焊，节约了钎焊时间与成本，在我国陶瓷覆铜基板市场有着广泛的应用。
Silicon nitride ceramic copper-clad substrate and preparation method thereof
一种氮化硅陶瓷覆铜基板及其制备方法
WU HAIBING (Autor:in) / CHEN YINGFENG (Autor:in)
25.03.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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