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High-purity ultrathin high-strength aluminum oxide ceramic substrate as well as preparation method and application thereof
The invention provides a high-purity ultrathin high-strength aluminum oxide ceramic substrate. The high-purity ultrathin high-strength aluminum oxide ceramic substrate comprises the following raw material components in parts by weight: 100 parts of aluminum oxide powder; 55-70 parts by weight of a mixed organic solvent of alcohol and ester; 1-2 parts by weight of a dispersant; 9-11 parts by weight of a binder; 1.5 to 5.5 parts by weight of a plasticizer; wherein the aluminum oxide powder is high-purity alpha-phase aluminum oxide powder with the purity larger than or equal to 99.9% and the particle size D50 ranging from 200 nm to 500 nm, the thickness of the aluminum oxide ceramic substrate ranges from 0.12 mm to 1.10 mm, the volume density is larger than or equal to 3.88 g/cm < 3 >, and the bending strength is larger than or equal to 550 MPa. The invention also provides a preparation method of the high-purity ultrathin high-strength aluminum oxide ceramic substrate and application of the high-purity ultrathin high-strength aluminum oxide ceramic substrate in a thin film integrated circuit.
本发明提供一种高纯超薄高强度氧化铝陶瓷基板,包括以下原材料组分和各原材料组分的重量份数:氧化铝粉体100重量份;醇和酯的混合有机溶剂55‑70重量份;分散剂1‑2重量份;粘结剂9‑11重量份;增塑剂1.5‑5.5重量份;其中,所述氧化铝粉体为纯度≥99.9%、粒径D50在200‑500nm的高纯α相氧化铝粉体,所述氧化铝陶瓷基板的厚度为0.12‑1.10mm,体积密度≥3.88g/cm3,弯曲强度≥550MPa。本发明还提供如上所述的高纯超薄高强度氧化铝陶瓷基板的制备方法和在薄膜集成电路中的应用。
High-purity ultrathin high-strength aluminum oxide ceramic substrate as well as preparation method and application thereof
The invention provides a high-purity ultrathin high-strength aluminum oxide ceramic substrate. The high-purity ultrathin high-strength aluminum oxide ceramic substrate comprises the following raw material components in parts by weight: 100 parts of aluminum oxide powder; 55-70 parts by weight of a mixed organic solvent of alcohol and ester; 1-2 parts by weight of a dispersant; 9-11 parts by weight of a binder; 1.5 to 5.5 parts by weight of a plasticizer; wherein the aluminum oxide powder is high-purity alpha-phase aluminum oxide powder with the purity larger than or equal to 99.9% and the particle size D50 ranging from 200 nm to 500 nm, the thickness of the aluminum oxide ceramic substrate ranges from 0.12 mm to 1.10 mm, the volume density is larger than or equal to 3.88 g/cm < 3 >, and the bending strength is larger than or equal to 550 MPa. The invention also provides a preparation method of the high-purity ultrathin high-strength aluminum oxide ceramic substrate and application of the high-purity ultrathin high-strength aluminum oxide ceramic substrate in a thin film integrated circuit.
本发明提供一种高纯超薄高强度氧化铝陶瓷基板,包括以下原材料组分和各原材料组分的重量份数:氧化铝粉体100重量份;醇和酯的混合有机溶剂55‑70重量份;分散剂1‑2重量份;粘结剂9‑11重量份;增塑剂1.5‑5.5重量份;其中,所述氧化铝粉体为纯度≥99.9%、粒径D50在200‑500nm的高纯α相氧化铝粉体,所述氧化铝陶瓷基板的厚度为0.12‑1.10mm,体积密度≥3.88g/cm3,弯曲强度≥550MPa。本发明还提供如上所述的高纯超薄高强度氧化铝陶瓷基板的制备方法和在薄膜集成电路中的应用。
High-purity ultrathin high-strength aluminum oxide ceramic substrate as well as preparation method and application thereof
一种高纯超薄高强度氧化铝陶瓷基板及其制备方法和应用
WANG ZHENGJUAN (Autor:in) / ZHOU GUOHONG (Autor:in) / XIA JINFENG (Autor:in) / XUE ZHENHAI (Autor:in) / HU SONG (Autor:in) / ZHANG HAILONG (Autor:in) / HUANG DEXIN (Autor:in) / WANG SHIWEI (Autor:in)
27.05.2022
Patent
Elektronische Ressource
Chinesisch
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