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Hot bending mold and preparation method thereof, curved surface ceramic part and electronic equipment
The invention provides a hot bending mold which is used for hot bending of a ceramic part, the hot bending mold is provided with a containing cavity, the containing cavity is used for containing the ceramic part, the hot bending mold comprises a mold body, a silicon dioxide layer and at least one barrier layer, and the silicon dioxide layer and the barrier layer are sequentially arranged on the side, close to the containing cavity, of the mold body. The material of the mold body comprises a silicon-containing compound, and the material of the barrier layer comprises an oxide ceramic material and does not contain silicon dioxide. According to the hot bending mold, the binding force between silicon dioxide and the mold body and the blocking layer is good, the stability of the overall structure is improved, the service life of the overall structure is prolonged, the blocking layer can prevent the ceramic piece from reacting with the mold body in the using process of the hot bending mold, mold sticking of the ceramic piece is avoided, demolding is easy, and the production yield of the ceramic piece is guaranteed. The invention further provides a preparation method of the hot bending mold, the curved-surface ceramic part and electronic equipment.
本申请提供了一种热弯模具,用于陶瓷件的热弯,所述热弯模具具有容置腔,所述容置腔用于容置所述陶瓷件,所述热弯模具包括模具本体,以及依次设置在所述模具本体靠近所述容置腔一侧的二氧化硅层以及至少一层阻挡层,所述模具本体的材质包括含硅化合物,所述阻挡层的材质包括氧化物陶瓷材料且不含二氧化硅。该热弯模具中二氧化硅与模具本体和阻挡层之间的结合力好,提升整体结构的稳定性和使用寿命,并且阻挡层可以阻隔热弯模具使用过程中陶瓷件与模具本体发生反应,避免陶瓷件粘模,容易脱模,保证陶瓷件的生产良率。本申请还提供了热弯模具的制备方法、曲面陶瓷件和电子设备。
Hot bending mold and preparation method thereof, curved surface ceramic part and electronic equipment
The invention provides a hot bending mold which is used for hot bending of a ceramic part, the hot bending mold is provided with a containing cavity, the containing cavity is used for containing the ceramic part, the hot bending mold comprises a mold body, a silicon dioxide layer and at least one barrier layer, and the silicon dioxide layer and the barrier layer are sequentially arranged on the side, close to the containing cavity, of the mold body. The material of the mold body comprises a silicon-containing compound, and the material of the barrier layer comprises an oxide ceramic material and does not contain silicon dioxide. According to the hot bending mold, the binding force between silicon dioxide and the mold body and the blocking layer is good, the stability of the overall structure is improved, the service life of the overall structure is prolonged, the blocking layer can prevent the ceramic piece from reacting with the mold body in the using process of the hot bending mold, mold sticking of the ceramic piece is avoided, demolding is easy, and the production yield of the ceramic piece is guaranteed. The invention further provides a preparation method of the hot bending mold, the curved-surface ceramic part and electronic equipment.
本申请提供了一种热弯模具,用于陶瓷件的热弯,所述热弯模具具有容置腔,所述容置腔用于容置所述陶瓷件,所述热弯模具包括模具本体,以及依次设置在所述模具本体靠近所述容置腔一侧的二氧化硅层以及至少一层阻挡层,所述模具本体的材质包括含硅化合物,所述阻挡层的材质包括氧化物陶瓷材料且不含二氧化硅。该热弯模具中二氧化硅与模具本体和阻挡层之间的结合力好,提升整体结构的稳定性和使用寿命,并且阻挡层可以阻隔热弯模具使用过程中陶瓷件与模具本体发生反应,避免陶瓷件粘模,容易脱模,保证陶瓷件的生产良率。本申请还提供了热弯模具的制备方法、曲面陶瓷件和电子设备。
Hot bending mold and preparation method thereof, curved surface ceramic part and electronic equipment
热弯模具及其制备方法、曲面陶瓷件和电子设备
ZHANG WENYU (Autor:in)
07.06.2022
Patent
Elektronische Ressource
Chinesisch
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