Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Flattening method for low-temperature co-fired ceramic substrate
The invention discloses a low-temperature co-fired ceramic substrate flat-firing method, and relates to the field of electronic component manufacturing processes, a block to be processed is cut into a plurality of target blocks, the target blocks are placed in a complete die cavity formed by splicing and overlapping a first die and a second die, and sintering is carried out. On one hand, the narrow space of the complete die cavity limits the warping space of the to-be-treated block in the sintering process, and the flatness of the sintered target block is guaranteed. And on the other hand, the to-be-treated blocks are cut before sintering, the multiple small target blocks are formed and then sintered, and the flatness of the target blocks after sintering is better guaranteed. Besides, a sacrificial layer is further arranged between the surface of the complete die cavity and the to-be-treated block besides the isolating layer, the to-be-treated block and the isolating layer are separated through gasification of the sacrificial layer, excessive isolating layer residues are prevented from being attached to the surface of the to-be-treated block, and follow-up cleaning is facilitated.
本申请公开了一种低温共烧陶瓷基板烧平方法，涉及电子元器件制作工艺领域，将待处理巴块切割成多个目标巴块后，放置于第一模具和第二模具拼接叠加所构成的完整模槽中，进行烧结。一方面，完整模槽的狭小空间将限制待处理巴块烧结过程中的翘曲空间，保证目标巴块烧结后的平整度。另一方面，在烧结前对待处理巴块进行切割，形成多个小型目标巴块后进行烧结，更加有利于保证目标巴块烧结后的平整度。此外，完整模槽表面与待处理巴块之间除了隔离层之外还设置有牺牲层，牺牲层气化隔开待处理巴块和隔离层，避免待处理巴块表面沾上过多隔离层残料，便于后续清洗。
Flattening method for low-temperature co-fired ceramic substrate
The invention discloses a low-temperature co-fired ceramic substrate flat-firing method, and relates to the field of electronic component manufacturing processes, a block to be processed is cut into a plurality of target blocks, the target blocks are placed in a complete die cavity formed by splicing and overlapping a first die and a second die, and sintering is carried out. On one hand, the narrow space of the complete die cavity limits the warping space of the to-be-treated block in the sintering process, and the flatness of the sintered target block is guaranteed. And on the other hand, the to-be-treated blocks are cut before sintering, the multiple small target blocks are formed and then sintered, and the flatness of the target blocks after sintering is better guaranteed. Besides, a sacrificial layer is further arranged between the surface of the complete die cavity and the to-be-treated block besides the isolating layer, the to-be-treated block and the isolating layer are separated through gasification of the sacrificial layer, excessive isolating layer residues are prevented from being attached to the surface of the to-be-treated block, and follow-up cleaning is facilitated.
本申请公开了一种低温共烧陶瓷基板烧平方法，涉及电子元器件制作工艺领域，将待处理巴块切割成多个目标巴块后，放置于第一模具和第二模具拼接叠加所构成的完整模槽中，进行烧结。一方面，完整模槽的狭小空间将限制待处理巴块烧结过程中的翘曲空间，保证目标巴块烧结后的平整度。另一方面，在烧结前对待处理巴块进行切割，形成多个小型目标巴块后进行烧结，更加有利于保证目标巴块烧结后的平整度。此外，完整模槽表面与待处理巴块之间除了隔离层之外还设置有牺牲层，牺牲层气化隔开待处理巴块和隔离层，避免待处理巴块表面沾上过多隔离层残料，便于后续清洗。
Flattening method for low-temperature co-fired ceramic substrate
一种低温共烧陶瓷基板烧平方法
HU CHUANDENG (Autor:in) / ZHANG XIANLI (Autor:in) / GUAN QIAN (Autor:in) / LI SHANSHAN (Autor:in)
03.01.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
Low-temperature co-fired raw ceramic, preparation method and ceramic substrate
| Europäisches Patentamt | 2023
Low-temperature co-fired ceramic substrate and preparation method thereof
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2024
Low Temperature Co-Fired Ceramic Substrate And Method of Producing The Same
| Europäisches Patentamt | 2016
Preparation method of silicon nitride/tungsten high-temperature co-fired ceramic substrate
| Europäisches Patentamt | 2022