Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
MULTILAYER CIRCUIT BOARD COMPRISING HIGH TEMPERATURE CO-FIRED CERAMIC
The present invention relates to a multilayered circuit board containing low temperature co-fired ceramic (LTCC), which satisfies low resistance properties and exhibits excellent mechanical properties and external appearance. According to an embodiment of the present invention, the ceramic multilayered circuit board can be produced by conducting sintering without reduction in sintering density at a relatively low temperature compared to a temperature for high temperature co-fired ceramic (HTCC). Since copper is not eluted out on a surface of substrates after sintered, the multilayered circuit board ensures outstanding mechanical properties, favorable low resistance properties, and uniform external appearance.
실시예는 저저항 특성을 만족하고 기계적 특성 및 외관 특성이 우수한 고온 동시 소성 세라믹을 포함하는 세라믹 다층회로 기판에 관한 것으로, 상기 세라믹 다층회로 기판은 기존 HTCC 온도보다 비교적 낮은 온도에서 소성밀도 저하없이 소성을 수행하여 제조될 수 있으며, 소성 후 구리가 기판의 표면에 용출되지 않아 외관이 불균일하지 않고, 저저항 특성을 만족하면서 우수한 기계적 특성을 갖는다.
MULTILAYER CIRCUIT BOARD COMPRISING HIGH TEMPERATURE CO-FIRED CERAMIC
The present invention relates to a multilayered circuit board containing low temperature co-fired ceramic (LTCC), which satisfies low resistance properties and exhibits excellent mechanical properties and external appearance. According to an embodiment of the present invention, the ceramic multilayered circuit board can be produced by conducting sintering without reduction in sintering density at a relatively low temperature compared to a temperature for high temperature co-fired ceramic (HTCC). Since copper is not eluted out on a surface of substrates after sintered, the multilayered circuit board ensures outstanding mechanical properties, favorable low resistance properties, and uniform external appearance.
실시예는 저저항 특성을 만족하고 기계적 특성 및 외관 특성이 우수한 고온 동시 소성 세라믹을 포함하는 세라믹 다층회로 기판에 관한 것으로, 상기 세라믹 다층회로 기판은 기존 HTCC 온도보다 비교적 낮은 온도에서 소성밀도 저하없이 소성을 수행하여 제조될 수 있으며, 소성 후 구리가 기판의 표면에 용출되지 않아 외관이 불균일하지 않고, 저저항 특성을 만족하면서 우수한 기계적 특성을 갖는다.
MULTILAYER CIRCUIT BOARD COMPRISING HIGH TEMPERATURE CO-FIRED CERAMIC
고온 동시소성 세라믹을 포함하는 다층회로 기판
JANG BYUNG KYU (Autor:in) / KO SANG KI (Autor:in)
22.09.2017
Patent
Elektronische Ressource
Koreanisch
Sintering method of high-reliability multilayer co-fired ceramic circuit substrate
| Europäisches Patentamt | 2023
High-strength multilayer ceramic co-fired structure and preparation method thereof
| Europäisches Patentamt | 2020
| Europäisches Patentamt | 2023
Method for manufacturing multilayer co-fired ceramic substrate cavity
| Europäisches Patentamt | 2020