Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Easily-processed high-performance ceramic substrate and preparation method thereof
The invention discloses an easy-to-process high-performance ceramic substrate and a preparation method thereof, and relates to the technical field of ceramic substrate processing and manufacturing. The preparation method provided by the invention comprises the following steps: carrying out low-temperature sintering, fretsaw processing and high-temperature heat treatment on a prepared ceramic biscuit, and finally grinding and polishing to obtain the high-performance ceramic substrate. Wherein the density of the obtained ceramic sintered block can be regulated and controlled to be 50-95% of theoretical density, the bending strength of the ceramic sintered block is 20-85% of that of a finished product, and the hardness (HV) of the ceramic sintered block is 1.5-12 GPa by regulating and controlling the temperature and time of low-temperature sintering, the performance of the ceramic sintered block is easier to perform fretsaw processing, and the processing efficiency is remarkably improved; in addition, the ceramic sintered body can ensure that the cracking phenomenon does not occur when a thinner ceramic sheet (0.35-2mm) is processed, and defective products are avoided. The processed ceramic sheet can be further sintered to be fully dense or highly dense after being subjected to high-temperature heat treatment, the hardness, bending strength and heat conductivity are improved, and the finished product performance requirements of the ceramic substrate are met.
本发明公开了一种易加工高性能陶瓷基板及其制备方法，涉及陶瓷基板加工制造技术领域。本发明提供制备方法，将制得的陶瓷素坯经低温烧结、线锯加工、高温热处理最后研磨抛光得到高性能陶瓷基板；其中，通过调控低温烧结的温度和时间可以调控得到的陶瓷烧结块体致密度为理论密度的50～95％，弯曲强度为成品的20％～85％，硬度(HV)为1.5～12GPa，这种陶瓷烧结块体的性能更易于进行线锯加工，加工效率显著提高；此外，这种陶瓷烧结体能够确保在加工较薄的陶瓷薄片(0.35～2mm)时不会出现崩裂现象，避免出现残次品。加工得到的陶瓷薄片经高温热处理可以使陶瓷薄片进一步烧结至全致密或者高致密，提高硬度，弯曲强度及热导率，达到符合陶瓷基板的成品性能要求。
Easily-processed high-performance ceramic substrate and preparation method thereof
The invention discloses an easy-to-process high-performance ceramic substrate and a preparation method thereof, and relates to the technical field of ceramic substrate processing and manufacturing. The preparation method provided by the invention comprises the following steps: carrying out low-temperature sintering, fretsaw processing and high-temperature heat treatment on a prepared ceramic biscuit, and finally grinding and polishing to obtain the high-performance ceramic substrate. Wherein the density of the obtained ceramic sintered block can be regulated and controlled to be 50-95% of theoretical density, the bending strength of the ceramic sintered block is 20-85% of that of a finished product, and the hardness (HV) of the ceramic sintered block is 1.5-12 GPa by regulating and controlling the temperature and time of low-temperature sintering, the performance of the ceramic sintered block is easier to perform fretsaw processing, and the processing efficiency is remarkably improved; in addition, the ceramic sintered body can ensure that the cracking phenomenon does not occur when a thinner ceramic sheet (0.35-2mm) is processed, and defective products are avoided. The processed ceramic sheet can be further sintered to be fully dense or highly dense after being subjected to high-temperature heat treatment, the hardness, bending strength and heat conductivity are improved, and the finished product performance requirements of the ceramic substrate are met.
本发明公开了一种易加工高性能陶瓷基板及其制备方法，涉及陶瓷基板加工制造技术领域。本发明提供制备方法，将制得的陶瓷素坯经低温烧结、线锯加工、高温热处理最后研磨抛光得到高性能陶瓷基板；其中，通过调控低温烧结的温度和时间可以调控得到的陶瓷烧结块体致密度为理论密度的50～95％，弯曲强度为成品的20％～85％，硬度(HV)为1.5～12GPa，这种陶瓷烧结块体的性能更易于进行线锯加工，加工效率显著提高；此外，这种陶瓷烧结体能够确保在加工较薄的陶瓷薄片(0.35～2mm)时不会出现崩裂现象，避免出现残次品。加工得到的陶瓷薄片经高温热处理可以使陶瓷薄片进一步烧结至全致密或者高致密，提高硬度，弯曲强度及热导率，达到符合陶瓷基板的成品性能要求。
Easily-processed high-performance ceramic substrate and preparation method thereof
一种易加工高性能陶瓷基板及其制备方法
WU SHANGHUA (Autor:in) / LONG GUOQIN (Autor:in) / LI YEHUA (Autor:in)
01.12.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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