Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic matrix composite heat dissipation substrate and preparation method and application thereof
The invention discloses a ceramic matrix composite heat dissipation substrate and a preparation method and application thereof, and relates to the technical field of ceramic heat dissipation substrate preparation. The heat dissipation substrate comprises a Cf/SiC layer, a CVD-SiC layer, a silicon nano layer and a copper silicide layer, the outer surface of the Cf/SiC layer is coated with the CVD-SiC layer, the upper surface of the CVD-SiC layer is covered with the silicon nano layer, and the upper surface of the silicon nano layer is covered with the copper silicide layer; and the Cf/SiC layer is a carbon fiber cloth reinforced silicon carbide ceramic matrix composite material. The heat conductivity of the ceramic-based composite heat dissipation substrate is larger than 296 W/(m.K), and the ceramic-based composite heat dissipation substrate is high in fracture toughness, high in breaking strength and suitable for being used on a high-power module. The problem that in the prior art, a ceramic heat dissipation substrate is low in heat conductivity is solved.
本发明公开了一种陶瓷基复合材料散热基板及制备方法和应用，涉及陶瓷散热基板制备技术领域。该散热基板包括：Cf/SiC层、CVD‑SiC层、硅纳米层和硅化铜层；CVD‑SiC层包覆在Cf/SiC层的外表面，硅纳米层覆盖在CVD‑SiC层的上表面，硅化铜层覆盖在硅纳米层的上表面；Cf/SiC层为碳纤维布增强的碳化硅陶瓷基复合材料。本发明制得的陶瓷基复合材料散热基板热导率＞296W/(m·K)，断裂韧性高，抗折强度高，适合在大功率模块上使用。本发明解决了现有技术中陶瓷散热基板的热导率低的问题。
Ceramic matrix composite heat dissipation substrate and preparation method and application thereof
The invention discloses a ceramic matrix composite heat dissipation substrate and a preparation method and application thereof, and relates to the technical field of ceramic heat dissipation substrate preparation. The heat dissipation substrate comprises a Cf/SiC layer, a CVD-SiC layer, a silicon nano layer and a copper silicide layer, the outer surface of the Cf/SiC layer is coated with the CVD-SiC layer, the upper surface of the CVD-SiC layer is covered with the silicon nano layer, and the upper surface of the silicon nano layer is covered with the copper silicide layer; and the Cf/SiC layer is a carbon fiber cloth reinforced silicon carbide ceramic matrix composite material. The heat conductivity of the ceramic-based composite heat dissipation substrate is larger than 296 W/(m.K), and the ceramic-based composite heat dissipation substrate is high in fracture toughness, high in breaking strength and suitable for being used on a high-power module. The problem that in the prior art, a ceramic heat dissipation substrate is low in heat conductivity is solved.
本发明公开了一种陶瓷基复合材料散热基板及制备方法和应用，涉及陶瓷散热基板制备技术领域。该散热基板包括：Cf/SiC层、CVD‑SiC层、硅纳米层和硅化铜层；CVD‑SiC层包覆在Cf/SiC层的外表面，硅纳米层覆盖在CVD‑SiC层的上表面，硅化铜层覆盖在硅纳米层的上表面；Cf/SiC层为碳纤维布增强的碳化硅陶瓷基复合材料。本发明制得的陶瓷基复合材料散热基板热导率＞296W/(m·K)，断裂韧性高，抗折强度高，适合在大功率模块上使用。本发明解决了现有技术中陶瓷散热基板的热导率低的问题。
Ceramic matrix composite heat dissipation substrate and preparation method and application thereof
一种陶瓷基复合材料散热基板及制备方法和应用
ZHANG HAISHENG (Autor:in) / YANG YONG (Autor:in) / CHENG LAIFEI (Autor:in) / NIU CHANGHUI (Autor:in) / WANG QING (Autor:in) / FU ZHIQIANG (Autor:in) / CUI XUEFENG (Autor:in)
26.04.2024
Patent
Elektronische Ressource
Chinesisch
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