Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic substrate containing heat dissipation copper pipe and preparation method thereof
The invention belongs to the related technical field of electronic packaging, and provides a ceramic substrate containing a heat dissipation copper pipe and a preparation method of the ceramic substrate. The ceramic substrate comprises a ceramic substrate body, the upper surface of the ceramic substrate body is a metal circuit layer, the lower surface of the ceramic substrate body is provided with an electroplating copper layer and a heat dissipation copper pipe, and the ceramic substrate is characterized in that the heat dissipation copper pipe is embedded into the electroplating copper layer through the electroplating bonding technology. According to the ceramic substrate containing the heat dissipation copper pipe and the preparation method thereof, the ceramic substrate has the advantages of being compact in structure, high in heat dissipation capacity, simple in preparation process, high in production efficiency and the like.
本发明属于电子封装相关技术领域，提供了一种含散热铜管的陶瓷基板及其制备方法。该陶瓷基板包括陶瓷基片，所述陶瓷基片上表面为金属线路层，所述陶瓷基片下表面有电镀铜层和散热铜管，其特征在于，所述散热铜管采用电镀键合工艺嵌入到电镀铜层内。本发明提出的含散热铜管的陶瓷基板及其制备方法，具有结构紧凑，散热能力强，制备工艺简单，生产效率高等优点。
Ceramic substrate containing heat dissipation copper pipe and preparation method thereof
The invention belongs to the related technical field of electronic packaging, and provides a ceramic substrate containing a heat dissipation copper pipe and a preparation method of the ceramic substrate. The ceramic substrate comprises a ceramic substrate body, the upper surface of the ceramic substrate body is a metal circuit layer, the lower surface of the ceramic substrate body is provided with an electroplating copper layer and a heat dissipation copper pipe, and the ceramic substrate is characterized in that the heat dissipation copper pipe is embedded into the electroplating copper layer through the electroplating bonding technology. According to the ceramic substrate containing the heat dissipation copper pipe and the preparation method thereof, the ceramic substrate has the advantages of being compact in structure, high in heat dissipation capacity, simple in preparation process, high in production efficiency and the like.
本发明属于电子封装相关技术领域，提供了一种含散热铜管的陶瓷基板及其制备方法。该陶瓷基板包括陶瓷基片，所述陶瓷基片上表面为金属线路层，所述陶瓷基片下表面有电镀铜层和散热铜管，其特征在于，所述散热铜管采用电镀键合工艺嵌入到电镀铜层内。本发明提出的含散热铜管的陶瓷基板及其制备方法，具有结构紧凑，散热能力强，制备工艺简单，生产效率高等优点。
Ceramic substrate containing heat dissipation copper pipe and preparation method thereof
一种含散热铜管的陶瓷基板及其制备方法
LIU SONGPO (Autor:in) / LIU XUECHANG (Autor:in) / ZHANG SHUQIANG (Autor:in) / HUANG WEIJUN (Autor:in)
28.03.2023
Patent
Elektronische Ressource
Chinesisch
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