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Alumina ceramic substrate material, preparation method and application
The invention relates to the field of electronic packaging substrates, in particular to an aluminum oxide ceramic substrate material and a preparation method and application thereof.The aluminum oxide ceramic substrate material comprises, by mass, 90-99% of aluminum oxide and 1-10% of a sintering aid, the sintering aid is xB2O3.zSiO2.yBi2O3, x is larger than or equal to 15 and smaller than or equal to 25, y is larger than or equal to 50 and smaller than or equal to 70, z is larger than or equal to 15 and smaller than or equal to 25, x + y + z = 100, and x: y: z is the mass ratio; the density of the alumina ceramic substrate is greater than or equal to 3.8 g/cm < 3 >, the surface roughness is less than or equal to 0.35 mu m, the anti-breakdown strength is greater than or equal to 35kV/mm, the anti-bending angle is greater than or equal to 350MPa, and the thermal conductivity is greater than or equal to 25W/m.K. The aluminum oxide ceramic substrate provided by the invention has the characteristics of high density, uniform microstructure, good surface flatness, high mechanical strength, high anti-breakdown strength, low dielectric loss, high thermal conductivity and the like.
本发明涉及电子封装基板领域,特别涉及一种氧化铝陶瓷基板材料、制备方法和应用,该氧化铝陶瓷基板的成分包括质量百分比90‑99wt%氧化铝和1‑10wt%烧结助剂,所述烧结助剂的成分为xB2O3·zSiO2·yBi2O3,15≦x≦25,50≦y≦70,15≦z≦25,x+y+z=100,其中,x:y:z为质量比;氧化铝陶瓷基板的密度≥3.8g/cm3,表面粗糙度≤0.35μm,抗击穿强度≥35kV/mm,抗弯曲角度≥350MPa,热导率≥25W/m·K。本发明的氧化铝陶瓷基板具有致密度高、微观结构均匀、表面平整度好、机械强度高、抗击穿强度高、介电损耗低、热导率高等特点。
Alumina ceramic substrate material, preparation method and application
The invention relates to the field of electronic packaging substrates, in particular to an aluminum oxide ceramic substrate material and a preparation method and application thereof.The aluminum oxide ceramic substrate material comprises, by mass, 90-99% of aluminum oxide and 1-10% of a sintering aid, the sintering aid is xB2O3.zSiO2.yBi2O3, x is larger than or equal to 15 and smaller than or equal to 25, y is larger than or equal to 50 and smaller than or equal to 70, z is larger than or equal to 15 and smaller than or equal to 25, x + y + z = 100, and x: y: z is the mass ratio; the density of the alumina ceramic substrate is greater than or equal to 3.8 g/cm < 3 >, the surface roughness is less than or equal to 0.35 mu m, the anti-breakdown strength is greater than or equal to 35kV/mm, the anti-bending angle is greater than or equal to 350MPa, and the thermal conductivity is greater than or equal to 25W/m.K. The aluminum oxide ceramic substrate provided by the invention has the characteristics of high density, uniform microstructure, good surface flatness, high mechanical strength, high anti-breakdown strength, low dielectric loss, high thermal conductivity and the like.
本发明涉及电子封装基板领域,特别涉及一种氧化铝陶瓷基板材料、制备方法和应用,该氧化铝陶瓷基板的成分包括质量百分比90‑99wt%氧化铝和1‑10wt%烧结助剂,所述烧结助剂的成分为xB2O3·zSiO2·yBi2O3,15≦x≦25,50≦y≦70,15≦z≦25,x+y+z=100,其中,x:y:z为质量比;氧化铝陶瓷基板的密度≥3.8g/cm3,表面粗糙度≤0.35μm,抗击穿强度≥35kV/mm,抗弯曲角度≥350MPa,热导率≥25W/m·K。本发明的氧化铝陶瓷基板具有致密度高、微观结构均匀、表面平整度好、机械强度高、抗击穿强度高、介电损耗低、热导率高等特点。
Alumina ceramic substrate material, preparation method and application
一种氧化铝陶瓷基板材料、制备方法和应用
KONG LINGBING (Autor:in) / WU XINCHENG (Autor:in) / YANG BAINIAN (Autor:in) / ZHU BING (Autor:in) / CHU YANHONG (Autor:in)
14.05.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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