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Preparation method of three-dimensional aluminum nitride ceramic substrate for chip packaging
The invention relates to the technical field of electronic packaging materials, provides a preparation method of a three-dimensional aluminum nitride ceramic substrate for chip packaging, and solves the problems that a ceramic substrate prepared in the prior art is poor in air tightness, poor in thermal stability, low in reliability and low in metal circuit layer precision. Comprising the following steps: 1) preparing an AlN ceramic substrate; 2) preparing an AlN ceramic substrate; (3) a dam base plate is prepared; 4) pretreatment; and 5) preparing the three-dimensional aluminum nitride ceramic substrate.
本发明涉及电子封装材料技术领域，提供一种芯片封装用三维氮化铝陶瓷基板的制备方法，解决现有技术制备的陶瓷基板气密性较差、热稳定性不佳以及可靠性低、金属线路层精度低的问题；包括以下制备步骤：1)制备AlN陶瓷基片；2)制备AlN陶瓷基板；3)制备围坝基板；4)预处理；5)制备三维氮化铝陶瓷基板。
Preparation method of three-dimensional aluminum nitride ceramic substrate for chip packaging
The invention relates to the technical field of electronic packaging materials, provides a preparation method of a three-dimensional aluminum nitride ceramic substrate for chip packaging, and solves the problems that a ceramic substrate prepared in the prior art is poor in air tightness, poor in thermal stability, low in reliability and low in metal circuit layer precision. Comprising the following steps: 1) preparing an AlN ceramic substrate; 2) preparing an AlN ceramic substrate; (3) a dam base plate is prepared; 4) pretreatment; and 5) preparing the three-dimensional aluminum nitride ceramic substrate.
本发明涉及电子封装材料技术领域，提供一种芯片封装用三维氮化铝陶瓷基板的制备方法，解决现有技术制备的陶瓷基板气密性较差、热稳定性不佳以及可靠性低、金属线路层精度低的问题；包括以下制备步骤：1)制备AlN陶瓷基片；2)制备AlN陶瓷基板；3)制备围坝基板；4)预处理；5)制备三维氮化铝陶瓷基板。
Preparation method of three-dimensional aluminum nitride ceramic substrate for chip packaging
一种芯片封装用三维氮化铝陶瓷基板的制备方法
FENG JIAWEI (Autor:in) / SHI CHUNXI (Autor:in)
22.11.2024
Patent
Elektronische Ressource
Chinesisch
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