Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
SUBSTRAT FÜR EIN STROMMODUL MIT EINEM KÜHLKÖRPER, STROMMODUL MIT EINEM KÜHLKÖRPER UND VERFAHREN ZUR HERSTELLUNG DES SUBSTRATS FÜR DAS STROMMODUL MIT EINEM KÜHLKÖRPER
SUBSTRAT DESTINÉ À UN BLOC DE PUISSANCE DOTÉ D'UN PUITS DE CHALEUR, BLOC DE PUISSANCE DOTÉ D'UN PUITS DE CHALEUR, ET PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT DESTINÉ À UN BLOC DE PUISSANCE DOTÉ D'UN PUITS DE CHALEUR
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in) / KUROMITSU YOSHIROU (Autor:in)
05.05.2021
Patent
Elektronische Ressource
Englisch
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