Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE
A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of aAg-Cu eutectic structure layer (32) is set to 15 µm or less.
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE
A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of aAg-Cu eutectic structure layer (32) is set to 15 µm or less.
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE
SUBSTRAT FÜR LEISTUNGSMODULE, SUBSTRAT MIT KÜHLKÖRPER FÜR LEISTUNGSMODULE UND LEISTUNGSMODUL
SUBSTRAT POUR MODULES DE PUISSANCE, SUBSTRAT AVEC DISSIPATEUR THERMIQUE POUR MODULES DE PUISSANCE ET MODULE DE PUISSANCE
NAGATOMO YOSHIYUKI (Autor:in) / NISHIKAWA KIMIHITO (Autor:in) / TERASAKI NOBUYUKI (Autor:in)
14.04.2021
Patent
Elektronische Ressource
Englisch
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