Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE
The present invention provides a power module substrate (10) including an insulating substrate (11), a circuit layer (12) which is formed on one surface of the insulating substrate (11), and a metal layer (13) which is formed on the other surface of the insulating substrate (11), in which the circuit layer (12) has a first aluminum layer (12A) made of aluminum or an aluminum alloy which is bonded to the insulating substrate (11) and a first copper layer (12B) made of copper or a copper alloy which is bonded to the first aluminum layer (12A) by solid-phase diffusion, the metal layer (13) has a second aluminum layer (13A) made of aluminum or an aluminum alloy, and a relationship between a thickness t 1 of the circuit layer (12) and a thickness t 2 of the second aluminum layer (13A) of the metal layer (13) satisfy t 1 < t 2 .
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE
The present invention provides a power module substrate (10) including an insulating substrate (11), a circuit layer (12) which is formed on one surface of the insulating substrate (11), and a metal layer (13) which is formed on the other surface of the insulating substrate (11), in which the circuit layer (12) has a first aluminum layer (12A) made of aluminum or an aluminum alloy which is bonded to the insulating substrate (11) and a first copper layer (12B) made of copper or a copper alloy which is bonded to the first aluminum layer (12A) by solid-phase diffusion, the metal layer (13) has a second aluminum layer (13A) made of aluminum or an aluminum alloy, and a relationship between a thickness t 1 of the circuit layer (12) and a thickness t 2 of the second aluminum layer (13A) of the metal layer (13) satisfy t 1 < t 2 .
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE
SUBSTRAT FÜR LEISTUNGSMODULE, SUBSTRAT MIT KÜHLKÖRPER FÜR LEISTUNGSMODULE UND LEISTUNGSMODUL
SUBSTRAT POUR DES MODULES DE PUISSANCE, SUBSTRAT AYANT UN DISSIPATEUR THERMIQUE POUR DES MODULES DE PUISSANCE, ET MODULE DE PUISSANCE
NAGATOMO YOSHIYUKI (Autor:in) / TERASAKI NOBUYUKI (Autor:in) / KUROMITSU YOSHIROU (Autor:in)
05.08.2020
Patent
Elektronische Ressource
Englisch
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