Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE WITH HEAT SINK
A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the first aluminum layer and bonded on the other surface of the ceramic substrate and a second copper layer made from a same material as the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding, in which a thickness t1 of the first copper layer is 1.7 mm or larger and 5 mm or smaller, a sum of the thickness t1 of the first copper layer and a thickness t2 of the second copper layer is 7 mm or smaller, and a ratio t2/t1 between the thickness t1 of the first copper layer and the thickness t2 of the second copper layer is larger than 0 and 1.2 or smaller except for a range of 0.6 or larger and 0.8 or smaller.
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE WITH HEAT SINK
A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the first aluminum layer and bonded on the other surface of the ceramic substrate and a second copper layer made from a same material as the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding, in which a thickness t1 of the first copper layer is 1.7 mm or larger and 5 mm or smaller, a sum of the thickness t1 of the first copper layer and a thickness t2 of the second copper layer is 7 mm or smaller, and a ratio t2/t1 between the thickness t1 of the first copper layer and the thickness t2 of the second copper layer is larger than 0 and 1.2 or smaller except for a range of 0.6 or larger and 0.8 or smaller.
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE WITH HEAT SINK
SUBSTRAT FÜR LEISTUNGSMODULE, SUBSTRAT MIT KÜHLKÖRPER FÜR LEISTUNGSMODULE UND LEISTUNGSMODUL MIT KÜHLKÖRPER
SUBSTRAT POUR MODULES DE PUISSANCE, SUBSTRAT AYANT UN DISSIPATEUR THERMIQUE POUR MODULES DE PUISSANCE, ET MODULE DE PUISSANCE AYANT UN DISSIPATEUR THERMIQUE
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
16.12.2020
Patent
Elektronische Ressource
Englisch
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE
| Europäisches Patentamt | 2020
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE
| Europäisches Patentamt | 2021
HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULES, AND POWER MODULE
| Europäisches Patentamt | 2015
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2016