Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUBSTRATE UNIT FOR POWER MODULES, AND POWER MODULE
In a power-module substrate unit 51, a circuit layer 12 is structured by a plurality of small circuit layers 12S; a ceramic substrate layer 11 is structured by at least one plate; the small circuit layers 12S are formed to have a layered structure having a first aluminum layer 15 bonded on one surface of the ceramic substrate layer 11 and a first copper layer 16 bonded on the first aluminum layer 15 by solid diffusion; a radiation plate 30 is made of copper or copper alloy; the metal layer 13 and the radiation plate 30 are bonded by solid diffusion, and a ratio (t1 × A1 × Ã1) / (t2 × A2 × Ã2) is not smaller than 0.80 and not larger than 1.20 where a thickness is t1 (mm), a bonding area is A1 (mm 2 ), and an yield stress is Ã1 (N/mm 2 ) of the first copper layer 16; a thickness at a bonding position to the metal layer is t2 (mm), a bonding area is A2 (mm 2 ), and an yield stress of the radiation plate 30 is Ã2 (N/mm 2 ).
SUBSTRATE UNIT FOR POWER MODULES, AND POWER MODULE
In a power-module substrate unit 51, a circuit layer 12 is structured by a plurality of small circuit layers 12S; a ceramic substrate layer 11 is structured by at least one plate; the small circuit layers 12S are formed to have a layered structure having a first aluminum layer 15 bonded on one surface of the ceramic substrate layer 11 and a first copper layer 16 bonded on the first aluminum layer 15 by solid diffusion; a radiation plate 30 is made of copper or copper alloy; the metal layer 13 and the radiation plate 30 are bonded by solid diffusion, and a ratio (t1 × A1 × Ã1) / (t2 × A2 × Ã2) is not smaller than 0.80 and not larger than 1.20 where a thickness is t1 (mm), a bonding area is A1 (mm 2 ), and an yield stress is Ã1 (N/mm 2 ) of the first copper layer 16; a thickness at a bonding position to the metal layer is t2 (mm), a bonding area is A2 (mm 2 ), and an yield stress of the radiation plate 30 is Ã2 (N/mm 2 ).
SUBSTRATE UNIT FOR POWER MODULES, AND POWER MODULE
SUBSTRATEINHEIT FÜR STROMMODULE SOWIE STROMMODUL
UNITÉ DE SUBSTRAT POUR MODULES DE PUISSANCE, ET MODULE DE PUISSANCE
OI SOTARO (Autor:in) / OOHIRAKI TOMOYA (Autor:in)
03.06.2020
Patent
Elektronische Ressource
Englisch
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE
| Europäisches Patentamt | 2020
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES AND POWER MODULE
| Europäisches Patentamt | 2021