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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    Neue Suche nach: MIRIC ANTON
    Neue Suche nach: RAUER MIRIAM
    Neue Suche nach: JUNG CHRISTIAN
    Neue Suche nach: HERBST KAI
    Neue Suche nach: DIETRICH PETER

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.

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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    Neue Suche nach: MIRIC ANTON
    Neue Suche nach: RAUER MIRIAM
    Neue Suche nach: JUNG CHRISTIAN
    Neue Suche nach: HERBST KAI
    Neue Suche nach: DIETRICH PETER

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.

    Zugriff

    Download

    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    Neue Suche nach: MIRIC ANTON
    Neue Suche nach: RAUER MIRIAM
    Neue Suche nach: JUNG CHRISTIAN
    Neue Suche nach: HERBST KAI
    Neue Suche nach: DIETRICH PETER

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.

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    Zugriff

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    Ähnliche Titel

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    Titel:

    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    Weitere Titelangaben:

    DURCH DICKSCHICHTPASTE VERMITTELTE, MIT METALL- ODER METALLHYBRIDFOLIEN VERBUNDENE KERAMIK UND DURCHGÄNGE
    CÉRAMIQUES À MÉDIATION DE PÂTE POUR COUCHES ÉPAISSES LIÉES À DES FEUILLES EN HYBRIDES DE MÉTAL OU EN MÉTAL ET VIAS

    Beteiligte:

    MIRIC ANTON (Autor:in) / RAUER MIRIAM (Autor:in) / JUNG CHRISTIAN (Autor:in) / HERBST KAI (Autor:in) / DIETRICH PETER (Autor:in)

    Erscheinungsdatum:

    26.12.2018

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  H05K PRINTED CIRCUITS , Gedruckte Schaltungen / C04B Kalk , LIME

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