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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    New search for: MIRIC ANTON
    New search for: RAUER MIRIAM
    New search for: JUNG CHRISTIAN
    New search for: HERBST KAI
    New search for: DIETRICH PETER

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.

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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    New search for: MIRIC ANTON
    New search for: RAUER MIRIAM
    New search for: JUNG CHRISTIAN
    New search for: HERBST KAI
    New search for: DIETRICH PETER

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.

    Access

    Download

    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    New search for: MIRIC ANTON
    New search for: RAUER MIRIAM
    New search for: JUNG CHRISTIAN
    New search for: HERBST KAI
    New search for: DIETRICH PETER

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate. The metal-ceramic-substrate according to the present invention are provided with at least one vertical via (via-hole) in the ceramic in order to allow circuit interconnections.

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    Document information
    Title:

    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS AND VIAS

    Additional title:

    DURCH DICKSCHICHTPASTE VERMITTELTE, MIT METALL- ODER METALLHYBRIDFOLIEN VERBUNDENE KERAMIK UND DURCHGÄNGE
    CÉRAMIQUES À MÉDIATION DE PÂTE POUR COUCHES ÉPAISSES LIÉES À DES FEUILLES EN HYBRIDES DE MÉTAL OU EN MÉTAL ET VIAS

    Contributors:

    MIRIC ANTON (author) / RAUER MIRIAM (author) / JUNG CHRISTIAN (author) / HERBST KAI (author) / DIETRICH PETER (author)

    Publication date:

    2018-12-26

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  H05K PRINTED CIRCUITS , Gedruckte Schaltungen / C04B Kalk , LIME

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