Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC-COPPER CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
A ceramic-copper circuit substrate according to an embodiment of the present invention includes a ceramic substrate, and a copper circuit board disposed on one surface of the ceramic substrate. The present invention is characterized by the following: the proportion of the thickness of the copper circuit board to that of the ceramic substrate is at least 1.25; and the number of grain boundaries even on 10mm of any straight line drawn on the surface of the copper circuit board is 5 to 250.
CERAMIC-COPPER CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
A ceramic-copper circuit substrate according to an embodiment of the present invention includes a ceramic substrate, and a copper circuit board disposed on one surface of the ceramic substrate. The present invention is characterized by the following: the proportion of the thickness of the copper circuit board to that of the ceramic substrate is at least 1.25; and the number of grain boundaries even on 10mm of any straight line drawn on the surface of the copper circuit board is 5 to 250.
CERAMIC-COPPER CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
KERAMIK-KUPFER-SCHALTUNGSSUBSTRAT UND HALBLEITERBAUELEMENT DAMIT
SUBSTRAT DE CIRCUIT EN CUIVRE-CÉRAMIQUE ET DISPOSITIF À SEMI-CONDUCTEUR FAISANT APPEL AUDIT SUBSTRAT
KATO HIROMASA (Autor:in) / SANO TAKASHI (Autor:in)
31.08.2022
Patent
Elektronische Ressource
Englisch
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