Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CONDUCTIVE FILM USING COPPER-BASED NANOPARTICLE DISPERSION AND MANUFACTURING METHOD THEREFOR
PROBLEM TO BE SOLVED: To provide a conducive film having low resistance by a short time and low temperature treatment and a manufacturing method therefor.SOLUTION: A manufacturing method has a step Sa1 for preparing a dispersion where a copper-based nanoparticle mainly containing CuO is dispersed stably without deposition, a step Sa2 for applying the dispersion onto a substrate and drying them to obtain a coated film mainly containing CuO, a step Sa3-1 for oxidizing the whole coated film to become CuO and controlling oxidation condition of the coated film with not processing with oxidation to CuO by heating the coated film at a temperature of 200°C or less at ambient pressure and a step Sa3-2 for heating the coated film at the temperature of 200°C or less in reductive atmosphere to reduce the coated film by a chemical reduction reaction process having an orientation to proceed with a reaction from the substrate to a surface of the coated film.SELECTED DRAWING: Figure 1
【課題】短時間かつ低温処理によって低抵抗な導体膜とその製造方法を提供する。【解決手段】Ｃｕ２Ｏを主成分とする銅系ナノ粒子が沈降することなく安定的に分散した分散液を準備するステップＳａ１と、前記分散液を基材上に塗布及び乾燥してＣｕ２Ｏを主成分とする塗膜を得るステップＳａ２と、大気圧中で前記塗膜を２００℃以下の温度で加熱して前記塗膜の全体がＣｕ２Ｏとなるまで酸化するとともにＣｕＯまで酸化が進行しないように前記塗膜の酸化状態を制御するステップＳａ３−１と、還元性雰囲気中で前記塗膜を２００℃以下の温度で加熱して前記基材から前記塗膜表面に向かって反応が進行する方向性のある化学的な還元反応プロセスによって前記塗膜を還元するステップＳａ３−２とを備える。【選択図】図１
CONDUCTIVE FILM USING COPPER-BASED NANOPARTICLE DISPERSION AND MANUFACTURING METHOD THEREFOR
PROBLEM TO BE SOLVED: To provide a conducive film having low resistance by a short time and low temperature treatment and a manufacturing method therefor.SOLUTION: A manufacturing method has a step Sa1 for preparing a dispersion where a copper-based nanoparticle mainly containing CuO is dispersed stably without deposition, a step Sa2 for applying the dispersion onto a substrate and drying them to obtain a coated film mainly containing CuO, a step Sa3-1 for oxidizing the whole coated film to become CuO and controlling oxidation condition of the coated film with not processing with oxidation to CuO by heating the coated film at a temperature of 200°C or less at ambient pressure and a step Sa3-2 for heating the coated film at the temperature of 200°C or less in reductive atmosphere to reduce the coated film by a chemical reduction reaction process having an orientation to proceed with a reaction from the substrate to a surface of the coated film.SELECTED DRAWING: Figure 1
【課題】短時間かつ低温処理によって低抵抗な導体膜とその製造方法を提供する。【解決手段】Ｃｕ２Ｏを主成分とする銅系ナノ粒子が沈降することなく安定的に分散した分散液を準備するステップＳａ１と、前記分散液を基材上に塗布及び乾燥してＣｕ２Ｏを主成分とする塗膜を得るステップＳａ２と、大気圧中で前記塗膜を２００℃以下の温度で加熱して前記塗膜の全体がＣｕ２Ｏとなるまで酸化するとともにＣｕＯまで酸化が進行しないように前記塗膜の酸化状態を制御するステップＳａ３−１と、還元性雰囲気中で前記塗膜を２００℃以下の温度で加熱して前記基材から前記塗膜表面に向かって反応が進行する方向性のある化学的な還元反応プロセスによって前記塗膜を還元するステップＳａ３−２とを備える。【選択図】図１
CONDUCTIVE FILM USING COPPER-BASED NANOPARTICLE DISPERSION AND MANUFACTURING METHOD THEREFOR
銅系ナノ粒子分散液を用いた導体膜とその製造方法
KAWASAKI MITSUO (Autor:in) / WADA HITOSHI (Autor:in) / SUGIMOTO MASAYUKI (Autor:in) / KAJITA OSAMU (Autor:in)
26.05.2016
Patent
Elektronische Ressource
Japanisch
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