Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
To provide a conductive composition capable of forming a conductive part having high adhesion to a ceramic substrate, and capable of manufacturing a metallized substrate having high plating resistance and reliability.SOLUTION: A conductive composition is prepared by combining Ag particles (A) made of isotropic Ag small particles (A1) having a particle size smaller than 1.2 μm and isotropic Ag large particles (A2) having a particle size equal to or larger than 1.2 μm, a metal component (B) made of a Mn component (B1), an Fe component (B2) and a Cu component (B3), and glass particles (C). The Ag small particles (A1) may be aspherical particles having a central particle size of 0.01 μm or larger and smaller than 1.2 μm. The Ag large particles (A2) may be spherical particles having a center particle size of 1.2 to 20 μm. A mass ratio of the Ag small particles (A1) and the Ag large particles is about the former/the latter=90/10 to 5/95. The glass particles (C) may contain bismuth-based glass particles and/or zinc-based glass particles.SELECTED DRAWING: None
【課題】セラミックス基板に対して密着性が高い導電部を形成でき、かつ耐めっき性および信頼性の高いメタライズド基板を製造できる導電性組成物を提供する。【解決手段】粒径１．２μｍ未満の等方形状Ａｇ小粒子（Ａ１）および粒径１．２μｍ以上の等方形状Ａｇ大粒子（Ａ２）からなるＡｇ粒子（Ａ）と、Ｍｎ成分（Ｂ１）、Ｆｅ成分（Ｂ２）およびＣｕ成分（Ｂ３）からなる金属成分（Ｂ）と、ガラス粒子（Ｃ）とを組み合わせて導電性組成物を調製する。前記Ａｇ小粒子（Ａ１）は、中心粒径０．０１μｍ以上、１．２μｍ未満の球状粒子であってもよい。前記Ａｇ大粒子（Ａ２）は、中心粒径１．２〜２０μｍの球状粒子であってもよい。前記Ａｇ小粒子（Ａ１）と前記Ａｇ大粒子（Ａ２）との質量比は、前者／後者＝９０／１０〜５／９５程度である。前記ガラス粒子（Ｃ）はビスマス系ガラス粒子および／または亜鉛系ガラス粒子を含んでいてもよい。【選択図】なし
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
To provide a conductive composition capable of forming a conductive part having high adhesion to a ceramic substrate, and capable of manufacturing a metallized substrate having high plating resistance and reliability.SOLUTION: A conductive composition is prepared by combining Ag particles (A) made of isotropic Ag small particles (A1) having a particle size smaller than 1.2 μm and isotropic Ag large particles (A2) having a particle size equal to or larger than 1.2 μm, a metal component (B) made of a Mn component (B1), an Fe component (B2) and a Cu component (B3), and glass particles (C). The Ag small particles (A1) may be aspherical particles having a central particle size of 0.01 μm or larger and smaller than 1.2 μm. The Ag large particles (A2) may be spherical particles having a center particle size of 1.2 to 20 μm. A mass ratio of the Ag small particles (A1) and the Ag large particles is about the former/the latter=90/10 to 5/95. The glass particles (C) may contain bismuth-based glass particles and/or zinc-based glass particles.SELECTED DRAWING: None
【課題】セラミックス基板に対して密着性が高い導電部を形成でき、かつ耐めっき性および信頼性の高いメタライズド基板を製造できる導電性組成物を提供する。【解決手段】粒径１．２μｍ未満の等方形状Ａｇ小粒子（Ａ１）および粒径１．２μｍ以上の等方形状Ａｇ大粒子（Ａ２）からなるＡｇ粒子（Ａ）と、Ｍｎ成分（Ｂ１）、Ｆｅ成分（Ｂ２）およびＣｕ成分（Ｂ３）からなる金属成分（Ｂ）と、ガラス粒子（Ｃ）とを組み合わせて導電性組成物を調製する。前記Ａｇ小粒子（Ａ１）は、中心粒径０．０１μｍ以上、１．２μｍ未満の球状粒子であってもよい。前記Ａｇ大粒子（Ａ２）は、中心粒径１．２〜２０μｍの球状粒子であってもよい。前記Ａｇ小粒子（Ａ１）と前記Ａｇ大粒子（Ａ２）との質量比は、前者／後者＝９０／１０〜５／９５程度である。前記ガラス粒子（Ｃ）はビスマス系ガラス粒子および／または亜鉛系ガラス粒子を含んでいてもよい。【選択図】なし
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
導電性組成物およびメタライズド基板ならびにそれらの製造方法
TOMIGA DAIKI (Autor:in)
10.12.2020
Patent
Elektronische Ressource
Japanisch
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
H01B
CABLES
,
Kabel
/
H05K
PRINTED CIRCUITS
,
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