Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
To provide a conductive composition capable of forming a conductive part having high adhesion to a ceramic substrate, and capable of manufacturing a metallized substrate having high plating resistance and reliability.SOLUTION: A conductive composition is prepared by combining Ag particles (A) made of Ag small particles (A1) having a particle size smaller than 1.2 μm and Ag large particles (A2) having a particle size equal to or larger than 1.2 μm, a metal component (B) made of a Mn component (B1), an Fe component (B2) and a Cu component (B3) and containing an organometallic compound, and glass particles (C). The organometallic compound may be a metal carboxylate. A ratio of the metal component (B) may be 0.5 to 5 pts.mass relative to 100 pts.mass of the Ag particles (A), in terms of metal element. The glass particles (C) may contain bismuth-based glass particles and/or zinc-based glass particles.SELECTED DRAWING: None
【課題】セラミックス基板に対して密着性が高い導電部を形成でき、かつ耐めっき性および信頼性の高いメタライズド基板を製造できる導電性組成物を提供する。【解決手段】粒径１．２μｍ未満のＡｇ小粒子（Ａ１）および粒径１．２μｍ以上のＡｇ大粒子（Ａ２）からなるＡｇ粒子（Ａ）と、Ｍｎ成分（Ｂ１）、Ｆｅ成分（Ｂ２）およびＣｕ成分（Ｂ３）からなり、かつ有機金属化合物を含む金属成分（Ｂ）と、ガラス粒子（Ｃ）とを組み合わせて導電性組成物を調製する。前記有機金属化合物はカルボン酸金属塩であってもよい。前記金属成分（Ｂ）の割合は、金属元素換算で、Ａｇ粒子（Ａ）１００質量部に対して０．５〜５質量部であってもよい。前記ガラス粒子（Ｃ）はビスマス系ガラス粒子および／または亜鉛系ガラス粒子を含んでいてもよい。【選択図】なし
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
To provide a conductive composition capable of forming a conductive part having high adhesion to a ceramic substrate, and capable of manufacturing a metallized substrate having high plating resistance and reliability.SOLUTION: A conductive composition is prepared by combining Ag particles (A) made of Ag small particles (A1) having a particle size smaller than 1.2 μm and Ag large particles (A2) having a particle size equal to or larger than 1.2 μm, a metal component (B) made of a Mn component (B1), an Fe component (B2) and a Cu component (B3) and containing an organometallic compound, and glass particles (C). The organometallic compound may be a metal carboxylate. A ratio of the metal component (B) may be 0.5 to 5 pts.mass relative to 100 pts.mass of the Ag particles (A), in terms of metal element. The glass particles (C) may contain bismuth-based glass particles and/or zinc-based glass particles.SELECTED DRAWING: None
【課題】セラミックス基板に対して密着性が高い導電部を形成でき、かつ耐めっき性および信頼性の高いメタライズド基板を製造できる導電性組成物を提供する。【解決手段】粒径１．２μｍ未満のＡｇ小粒子（Ａ１）および粒径１．２μｍ以上のＡｇ大粒子（Ａ２）からなるＡｇ粒子（Ａ）と、Ｍｎ成分（Ｂ１）、Ｆｅ成分（Ｂ２）およびＣｕ成分（Ｂ３）からなり、かつ有機金属化合物を含む金属成分（Ｂ）と、ガラス粒子（Ｃ）とを組み合わせて導電性組成物を調製する。前記有機金属化合物はカルボン酸金属塩であってもよい。前記金属成分（Ｂ）の割合は、金属元素換算で、Ａｇ粒子（Ａ）１００質量部に対して０．５〜５質量部であってもよい。前記ガラス粒子（Ｃ）はビスマス系ガラス粒子および／または亜鉛系ガラス粒子を含んでいてもよい。【選択図】なし
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
導電性組成物およびメタライズド基板ならびにそれらの製造方法
TOMIGA DAIKI (Autor:in)
10.12.2020
Patent
Elektronische Ressource
Japanisch
IPC:
H01B
CABLES
,
Kabel
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
CONDUCTIVE COMPOSITION AND METALLIZED SUBSTRATE AND MANUFACTURING METHOD THEREOF
| Europäisches Patentamt | 2020
CONDUCTIVE COMPOSITION, METALLIZED SUBSTRATE, AND METHODS FOR PRODUCING THE SAME
| Europäisches Patentamt | 2020
CONDUCTIVE COMPOSITION, METALLIZED SUBSTRATE, AND METHODS FOR PRODUCING THE SAME
| Europäisches Patentamt | 2020
Process for producing metallized substrate, and metallized substrate
| Europäisches Patentamt | 2016
METALLIZED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
| Europäisches Patentamt | 2017