Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joined body that can suppress the occurrence of crack in the ceramic member even when a severe thermal cycle is applied, and has excellent thermal cycle reliability.SOLUTION: Provided is a copper/ceramic joined body 10 which is formed by joining copper members 12 and 13 made of copper or a copper alloy, and a ceramic member 11, and in which, at a joint interface between the ceramic member 11 and the copper member 12, an active metal compound layer 21 is formed on the ceramic member 11 side, a maximum value of indentation hardness in the region from 20 μm to 50 μm from the interface of the active metal compound layer 21 with the copper member 12 to the copper member 12 side is 120 mgf/μm2 or more and 200 mgf/μm2 or less, and a difference between a maximum value HA of indentation hardness in a peripheral region A of the copper member 12 and a maximum value HB of indentation hardness in a central region B of the copper member 12 is 50 mgf/μm2 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２との接合界面において、セラミックス部材１１側には活性金属化合物層２１が形成されており、活性金属化合物層２１の銅部材１２との界面から銅部材１２側へ２０μｍから５０μｍまでの領域におけるインデンテーション硬さの最大値が１２０ｍｇｆ／μｍ２以上２００ｍｇｆ／μｍ２以下の範囲内とされ、銅部材１２の周縁部領域Ａにおける前記インデンテーション硬さの最大値ＨＡと、銅部材１２の中央部領域Ｂにおける前記インデンテーション硬さの最大値ＨＢとの差が５０ｍｇｆ／μｍ２以下である。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joined body that can suppress the occurrence of crack in the ceramic member even when a severe thermal cycle is applied, and has excellent thermal cycle reliability.SOLUTION: Provided is a copper/ceramic joined body 10 which is formed by joining copper members 12 and 13 made of copper or a copper alloy, and a ceramic member 11, and in which, at a joint interface between the ceramic member 11 and the copper member 12, an active metal compound layer 21 is formed on the ceramic member 11 side, a maximum value of indentation hardness in the region from 20 μm to 50 μm from the interface of the active metal compound layer 21 with the copper member 12 to the copper member 12 side is 120 mgf/μm2 or more and 200 mgf/μm2 or less, and a difference between a maximum value HA of indentation hardness in a peripheral region A of the copper member 12 and a maximum value HB of indentation hardness in a central region B of the copper member 12 is 50 mgf/μm2 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２との接合界面において、セラミックス部材１１側には活性金属化合物層２１が形成されており、活性金属化合物層２１の銅部材１２との界面から銅部材１２側へ２０μｍから５０μｍまでの領域におけるインデンテーション硬さの最大値が１２０ｍｇｆ／μｍ２以上２００ｍｇｆ／μｍ２以下の範囲内とされ、銅部材１２の周縁部領域Ａにおける前記インデンテーション硬さの最大値ＨＡと、銅部材１２の中央部領域Ｂにおける前記インデンテーション硬さの最大値ＨＢとの差が５０ｍｇｆ／μｍ２以下である。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (Autor:in)
26.01.2023
Patent
Elektronische Ressource
Japanisch
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