Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Cork Chip Elastic Packaging Material
The present invention relates to a cork chip elastic packaging material, which comprises: 20-45 parts by weight of cork chip particles; 5-15 parts by weight of red clay particles; 5-20 parts by weight of styrene ethylene butylene styrene copolymer (SEBS) particles; and 30-45 parts by weight of urethane adhesive. Accordingly, the urethane adhesive can be applied to surfaces of particles of the cork chip, the red clay, and the SEBS so as to enable the particles to be coupled to each other.
본 발명은 코르크 칩 탄성포장재에 있어서, 코르크 칩 입자 20~45 중량부, 적황토 입자 5~15 중량부, 스티렌에틸렌부틸렌스티렌 공중합체(SEBS) 입자 5~20 중량부 및 우레탄 접착제 30~45 중량부로 구성되되, 상기 코르크 칩, 적황토 및 스티렌에틸렌부틸렌스티렌 공중합체(SEBS)의 각각의 입자 표면에 우레탄 접착제가 도포되어 입자 간 결합된 구조인 코르크 칩 탄성포장재에 관한 것이다.
Cork Chip Elastic Packaging Material
The present invention relates to a cork chip elastic packaging material, which comprises: 20-45 parts by weight of cork chip particles; 5-15 parts by weight of red clay particles; 5-20 parts by weight of styrene ethylene butylene styrene copolymer (SEBS) particles; and 30-45 parts by weight of urethane adhesive. Accordingly, the urethane adhesive can be applied to surfaces of particles of the cork chip, the red clay, and the SEBS so as to enable the particles to be coupled to each other.
본 발명은 코르크 칩 탄성포장재에 있어서, 코르크 칩 입자 20~45 중량부, 적황토 입자 5~15 중량부, 스티렌에틸렌부틸렌스티렌 공중합체(SEBS) 입자 5~20 중량부 및 우레탄 접착제 30~45 중량부로 구성되되, 상기 코르크 칩, 적황토 및 스티렌에틸렌부틸렌스티렌 공중합체(SEBS)의 각각의 입자 표면에 우레탄 접착제가 도포되어 입자 간 결합된 구조인 코르크 칩 탄성포장재에 관한 것이다.
Cork Chip Elastic Packaging Material
코르크 칩 탄성포장재
NA SEONG TAEK (Autor:in) / SEOK JONG MIN (Autor:in) / JEON BONG SIK (Autor:in) / KIM DEA GEON (Autor:in)
21.06.2018
Patent
Elektronische Ressource
Koreanisch
IPC:
E01C
Bau von Straßen, Sportplätzen oder dgl., Decken dafür
,
CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE
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