SPUTTERING TARGET AND METHOD FOR PRODUCING SAME: Fid-Bau Portal

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

질량 %로, 순도가 99.99% 이상이며, 상대 밀도가 98% 이상이고, 또한 평균 결정 입경이 5㎛ 미만인 알루미나 소결체, 또는, 질량 %로, 순도가 99.999% 이상이며, 또한 상대 밀도가 98% 이상인 알루미나 소결체를 이용한 스퍼터링 타겟. 이 스퍼터링 타겟을 이용하면, 뛰어난 절연 내성과 균질성을 가지는 스퍼터막을 얻을 수 있다,

Zugriff

Download

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

Abstract

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

Abstract

Zugriff

Download

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

Weitere Titelangaben:

스퍼터링 타겟 및 그 제조 방법

Erscheinungsdatum:

07.03.2019

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Koreanisch

Klassifikation:

IPC: C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL / B22F Verarbeiten von Metallpulver , WORKING METALLIC POWDER / C04B Kalk , LIME

TERAMURA KYOSUKE | Europäisches Patentamt | 2022

Freier Zugriff

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

OSADA KOZO / KAJIYAMA JUN | Europäisches Patentamt | 2016

Freier Zugriff

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

Europäisches Patentamt | 2019

Freier Zugriff

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

OSADA KOZO / KAJIYAMA JUN | Europäisches Patentamt | 2017

Freier Zugriff

SPUTTERING TARGET MEMBER, SPUTTERING TARGET, METHOD FOR PRODUCING SPUTTERING TARGET MEMBER, AND METHOD FOR PRODUCING SPUTTERING FILM

SHIMOJUKU AKIRA / SATO ATSUSHI | Europäisches Patentamt | 2020

Freier Zugriff

Nach oben