Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device
According to the present invention, a dense composite material includes titanium silicide in an amount of 43 to 63 mass %; silicon carbide in an amount less than the mass percentage of the titanium silicide; and titanium carbide in an amount less than the mass percentage of the titanium silicide. In the dense composite material, a maximum value of interparticle distances of the silicon carbide is 40 μm or less, a standard deviation of the interparticle distances is 10 or less, and an open porosity of the dense composite material is 1% or less.
Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device
According to the present invention, a dense composite material includes titanium silicide in an amount of 43 to 63 mass %; silicon carbide in an amount less than the mass percentage of the titanium silicide; and titanium carbide in an amount less than the mass percentage of the titanium silicide. In the dense composite material, a maximum value of interparticle distances of the silicon carbide is 40 μm or less, a standard deviation of the interparticle distances is 10 or less, and an open porosity of the dense composite material is 1% or less.
Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device
NAGAI ASUMI (Autor:in) / NISHIMURA NOBORU (Autor:in) / YAMAGUCHI HIROFUMI (Autor:in)
10.01.2023
Patent
Elektronische Ressource
Englisch
Europäisches Patentamt | 2024
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2021
| Europäisches Patentamt | 2021
Europäisches Patentamt | 2020