A platform for research: civil engineering, architecture and urbanism
Design and Construction Issues for 300mm Semiconductor Manufacturing Facilities
Design and Construction Issues for 300mm Semiconductor Manufacturing Facilities
Design and Construction Issues for 300mm Semiconductor Manufacturing Facilities
Merchant, S. (author) / Chasey, A. (author) / Walsh, K. D. / American Society of Civil Engineers
6th, Construction congress; building together for a better tomorrow in an increasingly complex world ; 2000 ; Orlando, FL
2000-01-01
13 pages
Includes bibliographical references and index
Conference paper
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2006
|Doubleside polishing-a technology mandatory for 300mm wafer manufacturing
British Library Online Contents | 2002
|Structural Design of Semiconductor Manufacturing Facilities
British Library Conference Proceedings | 1997
|Defect requirements for advanced 300mm DRAM substrates
British Library Online Contents | 2002
|A roadmap towards cost efficient 300mm equipment
British Library Online Contents | 2002
|