Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

    New search for: Turng, L. S.
    New search for: Wang, V. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

    New search for: Turng, L. S.
    New search for: Wang, V. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

    New search for: Turng, L. S.
    New search for: Wang, V. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

    Contributors:

    Turng, L. S. (author) / Wang, V. W. (author)

    Published in:

    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 12 ; 506

    Publication date:

    1993-01-01

    Size:

    506 pages

    ISSN:

    0731-6844

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1923

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Synthesis and Properties of a Low Hygrothermal Stress Epoxy Molding Compound for Electronic Encapsulation

    Tai, H.-J. / Wang, J. B. / Chou, H.-L. | British Library Online Contents | 2000

    A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

    Abdullah, M.K. / Abdullah, M.Z. / Mujeebu, M.A. et al. | British Library Online Contents | 2009

    Failure paths at copper-base leadframe/epoxy molding compound interfaces

    Lee, H. Y. / Park, G. S. | British Library Online Contents | 2002

    Cure Behavior of Encapsulation Materials for Microelectronic Assembly of Bare IC Chips

    Palit, K. | British Library Online Contents | 1993

    Simulation-Based Design of Sheet Molding Compound (SMC) Compression Molding

    Twu, J.-T. / Lee, L. J. / Chen, S.-C. | British Library Online Contents | 1994

    Back to top