Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Failure paths at copper-base leadframe/epoxy molding compound interfaces

    New search for: Lee, H. Y.
    New search for: Park, G. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Failure paths at copper-base leadframe/epoxy molding compound interfaces

    New search for: Lee, H. Y.
    New search for: Park, G. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Failure paths at copper-base leadframe/epoxy molding compound interfaces

    New search for: Lee, H. Y.
    New search for: Park, G. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Failure paths at copper-base leadframe/epoxy molding compound interfaces

    Contributors:

    Lee, H. Y. (author) / Park, G. S. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 37 ; 4247 - 4257

    Publication date:

    2002-01-01

    Size:

    11 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Locus of failure between a nanowire-coated leadframe and an epoxy-based molding compound

    Lee, H. Y. / Chang, Y. K. | British Library Online Contents | 2004

    Analysis of failure of nanobelt-coated copper-based leadframe/epoxy-based molding compound systems after pull-out test

    Lee, H. Y. / Park, Y. B. / Jeon, I. et al. | British Library Online Contents | 2005

    Failure paths of the Cu-based leadframe/EMC joints

    Lee, H. Y. | British Library Online Contents | 2001

    Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces

    Lee, H.Y. / Yu, J. | British Library Online Contents | 2000

    Adhesion Enhancement for Improved MSL: This segment describes a novel process enhances adhesion between molding compound and copper alloy leadframe substrates

    Kurtz, O. / Wunderlich, C. / Ruther, R. et al. | British Library Online Contents | 2008

    Back to top