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    Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections

    New search for: Klinger, L.
    New search for: Glickman, E.
    New search for: Katsman, A.
    New search for: Levin, L.

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    Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections

    New search for: Klinger, L.
    New search for: Glickman, E.
    New search for: Katsman, A.
    New search for: Levin, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections

    New search for: Klinger, L.
    New search for: Glickman, E.
    New search for: Katsman, A.
    New search for: Levin, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections

    Contributors:

    Klinger, L. (author) / Glickman, E. (author) / Katsman, A. (author) / Levin, L. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 23 ; 15

    Publication date:

    1994-01-01

    Size:

    15 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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