Removal of Mechanical-Polishing-Induced Surface Damages on 4H-SiC Wafers by Using Chemical Etching with Molten KCl+KOH

Yao, Y.Z. / Ishikawa, Y. / Sugawara, Y. et al. | British Library Online Contents | 2014

Recombination lifetime characterization and mapping of silicon wafers and detectors using the microwave photoconductivity decay (mPCD) technique

Harkonen, J. / Tuovinen, E. / Li, Z. et al. | British Library Online Contents | 2006

Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers

Lu, Y. S. / Tani, Y. / Soutome, K. et al. | British Library Online Contents | 2007

Polishing Silicon Wafers with the Nanodiamond Abrasive Tools Prepared by Sol-Gel Technique

Hu, G.Q. / Lu, J. / Xu, X.P. | British Library Online Contents | 2012

Residual polishing damage and surface quality of commercial InP wafers: a scanning PL study

Laczik, Z. / Booker, G. R. / Mowbray, A. | British Library Online Contents | 1996