A platform for research: civil engineering, architecture and urbanism
Subsurface Damage in Single Diamond Tool Machined Si Wafers
Subsurface Damage in Single Diamond Tool Machined Si Wafers
Subsurface Damage in Single Diamond Tool Machined Si Wafers
McHedlidze, T. R. (author) / Yonenaga, I. (author) / Sumino, K. (author)
MATERIALS SCIENCE FORUM ; 1841-1846
1995-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Micro-Raman spectral analysis of the subsurface damage layer in machined silicon wafers
British Library Online Contents | 2000
|Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing
British Library Online Contents | 2017
|British Library Online Contents | 2016
|Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers
British Library Online Contents | 2009
|Effects of the Tool Angles on the Machined Surface Quality of KDP Crystal in Diamond Turning
British Library Online Contents | 2008
|