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Micro-Raman spectral analysis of the subsurface damage layer in machined silicon wafers

Chen, L.-Q. / Zhang, X. / Zhang, T.-Y. / Lin, H. Y. / Lee, S.

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Micro-Raman spectral analysis of the subsurface damage layer in machined silicon wafers

Chen, L.-Q. / Zhang, X. / Zhang, T.-Y. / Lin, H. Y. / Lee, S.

Micro-Raman spectral analysis of the subsurface damage layer in machined silicon wafers

Chen, L.-Q. / Zhang, X. / Zhang, T.-Y. / Lin, H. Y. / Lee, S.

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Check availability in my library

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Document information

Title:

Micro-Raman spectral analysis of the subsurface damage layer in machined silicon wafers

Contributors:

Chen, L.-Q. (author) / Zhang, X. (author) / Zhang, T.-Y. (author) / Lin, H. Y. (author) / Lee, S. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 15 ; 1441-1444

Publication date:

2000-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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