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Ti-diffusion barrier in Cu-based metallization
Ti-diffusion barrier in Cu-based metallization
Ti-diffusion barrier in Cu-based metallization
Braud, F. (author) / Torres, J. (author) / Palleau, J. (author) / Mermet, J. L. (author) / Mouche, M. J. (author) / Gessner, T / Schulz, S. E.
1996-01-01
6 pages
Article (Journal)
English
DDC:
621.35
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