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Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

Tripathi, C. C. / Kumar, M. / Kumar, D.

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Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

Tripathi, C. C. / Kumar, M. / Kumar, D.

Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

Tripathi, C. C. / Kumar, M. / Kumar, D.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

Contributors:

Tripathi, C. C. (author) / Kumar, M. (author) / Kumar, D. (author)

Published in:

APPLIED SURFACE SCIENCE ; 255 ; 3518-3522

Publication date:

2009-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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