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Diffusion barrier performance of TiVCr alloy film in Cu metallization
Diffusion barrier performance of TiVCr alloy film in Cu metallization
Diffusion barrier performance of TiVCr alloy film in Cu metallization
Tsai, D. C. (author) / Huang, Y. L. (author) / Lin, S. R. (author) / Jung, D. R. (author) / Chang, S. Y. (author) / Shieu, F. S. (author)
APPLIED SURFACE SCIENCE ; 257 ; 4923-4927
2011-01-01
5 pages
Article (Journal)
English
DDC:
621.35
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