Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Barrier behaviour of plasma deposited silicon oxide and nitride against Cu diffusion

    New search for: Vogt, M.
    New search for: Drescher, K.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Barrier behaviour of plasma deposited silicon oxide and nitride against Cu diffusion

    New search for: Vogt, M.
    New search for: Drescher, K.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Barrier behaviour of plasma deposited silicon oxide and nitride against Cu diffusion

    New search for: Vogt, M.
    New search for: Drescher, K.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Barrier behaviour of plasma deposited silicon oxide and nitride against Cu diffusion

    Contributors:

    Vogt, M. (author) / Drescher, K. (author) / Gessner, T. / Schulz, S. E.

    Published in:

    Materials for Advanced Metallization ; 303-307

    APPLIED SURFACE SCIENCE ; 91

    Publication date:

    1996-01-01

    Size:

    5 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Diffusion barrier properties of ionized metal plasma deposited tantalum nitride thin films between copper and silicon dioxide

    Latt, K. M. / Lee, Y. K. / Seng, H. L. et al. | British Library Online Contents | 2001

    Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

    Maung Latt, K. / Park, H. S. / Li, S. et al. | British Library Online Contents | 2002

    Fabrication of Mixed-Oxide Sequential Deposited Silicon Nitride Powders

    Tatli, Z. / Thompson, D. P. | British Library Online Contents | 2004

    Deuterium diffusion into plasma-deposited silicon oxynitride films

    Arnoldbik, W. M. / Maree, C. H. M. / Habraken, F. H. P. M. | British Library Online Contents | 1994

    Densification behaviour of oxide-coated silicon nitride powders

    Tatli, Z. / Thompson, D. P. | British Library Online Contents | 2005

    Back to top